Radiance laser cleaning tool unveiled–seminars to be held
Concord, NH–Neuman Micro Technologies, Inc. is preparing to unveil the first production Radiance System, a patented laser cleaning tool applicable to a broad range of cleaning applications, which utilizes a pulsed laser and flowing gas to dry-clean semiconductor wafers, photomasks and flat panel displays; clean industrial metals, medical devices and packaging, plastics, nylon, Teflon, optical and ceramic components, and rubber molds.
Terence O`Keeffe, senior application scientist for Neuman, reports the process also removes particles, organics and CMP slurry residue, mold lubricants, mold residues, environmental debris, oxide layers, paints and cutting burrs. Developed by Bethesda, MD-based Radiance Services Company (See “New Wafer Cleaning Method Eliminates Water/ Chemical Requirements,” CleanRooms, January 1996, p. 1) the technology is licensed to Neuman for production of the Radiance process tool, scheduled to be shipped in December to the U.S. Department of Defense and currently being built under the EPA`s Environmental Technology Initiative.
On December 5 and 6, a Radiance Laser Cleaning Process Seminar will be held in Concord to instruct participants on the process, on basic pulse laser technology, tooling requirements, and potential economic impact. Participants will also be invited to inspect the Radiance System in its near complete state, according to Orest Ohar, president of Neuman MicroTechnologies. The conference will feature speakers from both Neuman and Radiance Services Company. For further information, contact Stacey Gerred at Neuman Micro Technologies (603) 228-6862.