April 18, 2001 — HSINCHU, Taiwan — Taiwan Semiconductor Manufacturing Company (TSMC) has completed a 300 mm pilot for 0.13-micron, all copper process of a 4 megabyte SRAM test vehicle.

TSMC plans to test some of its customers’ 0.13-micron products later this month.

“The 300 mm technology will be the new workhorse technology. We are very pleased that the 300 mm, 0.13-micron, all-copper pilot yielded well. This clearly marks TSMC’s industry leading position for the 300 mm era, which ultimately will benefit our customers,” said N. S. Tai, senior director of TSMC’s 300 mm project.

According to company officials, TSMC owns Taiwan’s only 300 mm production facility.

The company is currently constructing two dedicated 300 mm production facilities – Fab12 in Hsinchu and Fab14 in Tainan. Fab12 is expected to enter risk production later this year and cleanroom construction at Fab14 will also be finished later this year.