SMALL TECH WORLD IN BRIEF
July 10, 2001

SILICON GENESIS DEVELOPS FABRICATION PROCESS

Increasing chip performance is one goal of a new fabrication process developer of Silicon-on-Insulator (SOI) wafer technologies.

Silicon Genesis Corp. of Campbell, Calif., has developed a commercial process for thick SOI wafers, or wafers thicker than 1 micron. SiGen said the new process provides a cost-efficient method of emerging micro-optical-electromechanical systems (MOEMS). Those applications include optical signal multiplexers and switches and development of methods for on-chip clock synchronization and data exchange.

Building circuits on SOI allows for more compact chip designs, resulting in smaller devices and more chips per wafer, the company said.

HK, CANADIAN OFFICIALS DISCUSS NANO PARTNERSHIP

Officials from Hong Kong and Canada met Tuesday in Hong Kong to discuss forming a partnership focused on advanced materials and nanotechnology, according to Xinhua, the official Chinese news agency.

The forum, brought together business and academic leaders from China and Canada.

MEMS OPTICAL NETS $18 MILLION IN FUNDING

A leading provider of MEMS-based precision micro-optics and components said it will use $18 million in corporate financing to expand its markets and boost manufacturing.

MEMS Optical Inc. , based in Huntsville, Ala., received money from the Summit Accelerator Fund, Vanguard Ventures, Dynafund Ventures and Teledyne Technologies Inc., the company said.

MEMS Optical, founded in 1997, designs and makes precision refractive and diffractive optics, long-reach micro-actuators and miniature tilt mirrors.

ADVA LAUNCHES ALL-OPTICAL SWITCH

A German optical network maker has introduced a MEMS-based all-optical switching module that it said will simplify and reduce costs of optical systems.

ADVA Optical Networking of Munich has launched the OXC plug-in module, which it has been demonstrating this week at the National Fiber Optic Engineers Conference in Baltimore.

The switch and transport are integrated on one platform, which eliminates the need for stand-alone switching elements. It also can be used in existing optical systems, the company said.

HITACHI DEMONSTRATES MULTIPLE OPTICAL SWITCHING SYSTEMS

Hitachi Telecom Inc. said it is the first company to demonstrate a dense wavelength division multiplexing (DWDM) system with multiple optical switches.

The DWDM contains an all-optical switching system, developed by Calient Networks, and an optical-to-electrical-to-optical (OEO) grooming switch system, from Brightlink Networks. DWDM is a fiber-optic transmission technique that uses light wavelengths to transmit data.

Hitachi said the multiple optical switch system offers data transmission at peak levels because the multiple system automatically adjusts to meet traffic and switching needs. By using the systems together, Hitachi said carriers can reduce costs because they need less equipment, and the product can be more easily upgraded.

Marlene Bourne, a senior analyst with Cahners In-Stat Group, said Hitachi might be the first to test the multiple optical switch “in the same box,” but at least a half-dozen other companies are working on the same technology.

“It’s easy to demonstrate a device, but it’s tough to put it into practice,” she said.

PURDUE PLANS NANOTECH CENTER

Purdue University officials have hired a design firm to plan a $60 million nanotechnology research facility, according to the Journal and Courier of Lafayette, Ind.

The center will include clean rooms, biology and chemistry laboratories and a nanotechnology incubator. The building also will have a plant to make new materials, such as silicon crystals used in the semiconductor industry, the report said.

The facility will be paid for with state government funding and corporate research contracts. If the money is raised, construction will begin in June 2002, and will be completed by fall 2004.


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CONTACT THE AUTHOR:
Jeff Karoub at [email protected] or call 734-994-1106.

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