Feb.25, 2002 – Kaohsiung, Taiwan – Semiconductor packaging and testing company, Advanced Semiconductor Engineering Inc. (ASE), said that its Taiwanese facilities will take a strategic role in Bluetooth’s development.
ASE is using its fine pitch bonding (FPB) technology to help lower the cost and increase the functionality of the Bluetooth chips, reported the Financial Times.
ASE has been working with Cambridge Silicon Radio (CSR), Cambridge, UK, to build a generation of Bluetooth chips with microcontroller, memory, and radio contained in a single chip.
ASE’s facility in Chung Li, Taiwan, is providing CSR turnkey packaging and test services including the application of FPB.
The FPB packaging technology features smaller solder balls and a finer pitch than conventional BGA (ball-grid array) solutions, ASE said, and it allows CSR to achieve low form factor for Bluetooth baseband, radio frequency, microcontroller, and memory units.
ASE’s Chung Li Industrial Intelligent Park, established in December 2000, will house operations such as assembly, materials, and testing. A new center, called Advanced Packaging Research and Development Center, is to be added.