Aug. 6, 2002 – Seoul, Korea – Samsung Electronics Co. plans to invest 133.5 billion won (some $112 million) to build two additional semiconductor lines that utilize 300mm wafers.
“We plan to use the funds to secure facilities that will allow the company to mass produce DRAM and flash chips with 300mm wafers,” a company spokesman told Dow Jones.
Samsung Electronics plans to make the investment sometime between 3Q02 and 1Q03, but didn’t say when it will start building the new lines. Production is expected to begin in 2004, the spokesman said.
The announcement comes after Samsung Electronics said it plans to invest an additional KRW 160.8 billion to upgrade two of its 13 existing semiconductor production lines at its Kiheung plant.
Samsung Electronics said it plans a total capital expenditure of KRW4.88 trillion for this year.