Applied Materials gets $45 million order from Tower

OCT. 22–SANTA CLARA, CA–Applied Materials Inc. has received more than $45 million in orders for chip-making equipment from Tower Semiconductor Ltd., an independent wafer-foundry in Migdal Haemek, Israel.

Tower plans to use the equipment for the production of 0.18-micron and 0.13-micron complementary metal oxide semiconductor (CMOS) digital logic, mixed signal, flash memory and image sensor devices in its new Fab 2 facility.

When Fab 2 is complete, Tower plans to offer 0.18-micron and smaller processes, producing up to 33,000 200 mm wafers per month and employing 1,100 people.

“The equipment installed in our pilot line met our performance criteria,” says Ron Niv, Towers’ Fab 2 manager says. “Applied Materials’ technologies will allow us to fabricate our customers’ most complex designs.”

Tower’s order specified multiple physical vapor deposition (PVD), rapid thermal processing (RTP) etch, high-density plasma chemical vapor deposition (HDP-CVD) wafer inspection, and defect review systems.

“These orders represent a continuation of our close relationship with Tower Semiconductor, and we are pleased to participate in the company’s success,” says Ashok K. Sinha, senior vice president of Applied Materials’ Silicon Business sector.

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