Feb. 11, 2003 – Singapore, and Milpitas, CA – ST Assembly Test Services Ltd. (STATS), an independent semiconductor test and advanced packaging service provider, has completed qualification of its frontend assembly operations for the packaging of high performance chips from 300mm wafers.
The automated Front-of-Line (FOL) in-line module that STATS has implemented is aimed at eliminating the handling risks associated with 300mm wafers. This is achieved by an automated taping of the wafer before the back grinding process begins. During the back grinding process, wafer thickness is automatically measured by the integrated in-line module. Upon completion of back grinding, the wafers are automatically mounted onto metal rings. The wafer is then well supported for the de-taping process in preparation for the wafer saw operation. The in-line module is capable of thinning 300mm wafers down to 100-micron for stacked die and SiP applications.