October 16, 2003 – Novellus Systems Inc., San Jose, CA, and Shanghai’s Fudan University plans to set up a semiconductor manufacturing technology research center focused on copper-based tools.
The Fudan-Novellus Interconnect Research Center will provide education and training for the school’s microelectronics program, incorporating a suite of Novellus’ copper-based IC interconnect and deposition tools, including tools for a plasma-enhanced CVD, ECD, PVD, and CMP.
Copper tools are attractive in China’s emerging industry, which wants high productivity at a low capital cost. “It is critical that the regions future technologists are introduced early to copper processing tools,” said Chien Chang, Novellus VP of R&D.
Fudan already hosts programs for ASIC and systems laboratory as well as microelectronics studies.