With this partnership, K&S increases its market share by delivering wire bond solutions over an expanded range of applications. The company launched a corporate strategy to increase market share earlier this year when it introduced a dual product to complement its high I/O Ultra-Fine Pitch Bonder Maxum. By adding a second distinct model, the Nu-TekTM, K&S leveraged its technology and expanded its market to include low I/O packages in strip and lead frame format. The new alliance with Nidec Tosok further extends the market potential for the Nu-Tek by adding a configuration of Nu-Tek for reel-to-reel discrete packages.

(November 11, 2003) Fremont, Calif.&#8212ChipPAC Inc., a provider of semiconductor assembly and test services, has delivered a six stacked-die CSP in a thin, 1.6-mm profile. The 17×17-mm dime-size package with more than 400 leads houses a DSP or an applications ASIC chip, along with flash and SDRAM chips for compact footprint products such as cell phones, PDAs and digital camera applications. Flash and DSP are projected to be the highest growth segments for semiconductors in 2004. An increasing part of this market growth will see the integration of flash and DSP in a multi-die package solution.