Carsem completes construction of packaging facility in China

Construction began in April 2003, and was completed in January this year. The initial staff was hired during the second quarter of 2003, and extensive training has begun in Carsem’s existing Malaysian factories. The assembly and test equipment to support the manufacture of the MLP (micro leadframe package) Quad and Dual family will be installed during the first quarter of 2004. Customer qualifications are expected to begin during the later part of the first quarter, with the factory in full production by the end of the second quarter of 2004.

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