While hafnium oxide prevents currents from leaking through the ultrathin layers of semiconductor chips more than 1,000 times better than conventional silicon oxide, its prospects have been dampened by too many current-draining defects.

(March 11, 2004) Research Triangle Park, N.C.&#8212Unitive Inc., a provider of wafer-level packaging solutions, has developed and qualified an electroplated lead-free bumping technology. The company’s SnAg lead-free solution is designed as an alternative to eutectic solder.