EV, Datacon combine bonder equipment

October 13, 2004 – EV Group, Scharding, Austria, and Datacon Technology AG, Radfeld, Austria, have agreed to jointly develop and market a new chip-to-wafer bonding platform combining their technologies.

The EVG540C2W platform bonds a wafer with single devices through a “solid liquid interdiffusion” metal-soldering process, fixed with an agent in Datacon’s flip-chip bonder. The goal is to allow chipmakers to integrate various device technologies, such as IC and MEMS functionality. The two companies said the platform already has been installed at Infineon.


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