EV, Datacon combine bonder equipment

October 13, 2004 – EV Group, Scharding, Austria, and Datacon Technology AG, Radfeld, Austria, have agreed to jointly develop and market a new chip-to-wafer bonding platform combining their technologies.

The EVG540C2W platform bonds a wafer with single devices through a “solid liquid interdiffusion” metal-soldering process, fixed with an agent in Datacon’s flip-chip bonder. The goal is to allow chipmakers to integrate various device technologies, such as IC and MEMS functionality. The two companies said the platform already has been installed at Infineon.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.