With a floor size of over 2,400 square meters, this new facility has full manufacturing capability for all types of enhanced cantilever probe cards. The facility can produce optimized probe designs for each customer’s application. Additionally, this new K&S plant can handle probe wire diameters from 75 to 250 microns, along with very fine pitch probing.

(October 15, 2004) Scharding and Radfeld, Austria&#8212EV Group, a supplier of wafer-bonding and lithography equipment, and Datacon Technology AG, a supplier of flip chip and die bonding equipment, announces a development agreement in the field of advanced-chip-to-wafer (AC2W) technology. The two companies also have agreed on joint strategic marketing and sales activities to promote the cooperation.