March 10, 2005 – Taiwan Semiconductor Manufacturing Co. (TSMC), PowerChip Semiconductor Corp. (PSC), and Vanguard International Semiconductor Corp. (VISC) are planning to spend over NT$300 billion (US$9.6 billion) on expansions at the Hsinchu Science-based Industrial Park (HSBIP) in northern Taiwan, said Financial Times Information Ltd. The three Taiwanese chipmakers will build a total of five 300mm wafer fabs.
TSMC has signed up a total 30 hectares of site at the HSBIP for its expansion plans of a 300mm wafer fab that will use leading-edge process technologies and a 35nm technology center at the park at an estimated cost of NT$100-200 billion (US$3.2-6.4 billion).
Chairman Frank Huang of PSC recently pointed out that his company had applied for a nine-hectare land with HSBIP authority to site its planned two 300mm fabs at a combined cost of US$4 billion. The facilities are designed to have a total output capacity of 80,000 wafers/month. Huang said his company would begin constructing the two fabs as early as the end of this year if land acquisition goes smoothly.
VISC Chairman Paul Chien said his company had applied for a seven-hectare land with HSBIP authority for its expansion plan.