SEMI rewards Japan-US trade guru
Congrats to Richard Dyck, president of TCS-Japan and the next recipient of SEMI’s annual Bob Graham Award for outstanding contributions in semiconductor equipment and materials marketing. Dyck was nominated for facilitating greater cultural awareness and business relationships between the Japanese and US semiconductor industries, and played a pivotal role in expanding the opportunities for US equipment suppliers there, with roles managing Teradyne’s ATE business and GE’s specialty materials division, according to SEMI. Dyck founded TCS-Japan in 1999 after acquiring the Japanese operations of Teradyne’s backplane connection system business. He also has helped shape the SEMI International Trade Partners Conference and the SEMI Japan Trade Study Group, which promoted greater cooperation during a time of US-Japan trade friction. The Bob Graham award, now in its eighth year, honors the late industry leader who helped found Intel and establish leading companies including Applied Materials Inc. and Novellus Systems Inc.
Seeding growth of nanoscientists
Kudos also goes out to Roger Grace, Northeastern U. grad who is sponsoring funding at his alma mater to support nanomanufacturing education for future scientists. The Roger H. Grace Fellowship in Nanomanufacturing will award a renewable one-year position at Northeastern’s NSF Center for High-rate Nanomanufacturing (CHN), with stipend to work on a project/thrust area. The CHN claims to be one of few research centers nationwide to focus solely on developing economically viable fabrication processes to bring inventions into commercial production, and do so more quickly than the usual multi-decade time frame. “The Roger Grace Fellowship will provide us with the means and the opportunity to hire the brightest and highly motivated students to work in this field at Northeastern,” stated prof. Ahmed Busnaina, director of the CHN. Qualified applicants (either admitted to or applying for a Ph.D program at Northeastern, with fabrication experience) should submit a cover letter, resume, and two letters of recommendation by March 26, 2007, for the summer and fall semesters.