Wafer-level packaging in the 3D present

by Ed Korczynski, Senior Technical Editor

Wafer-level packaging (WLP) may finally reach the mainstream for ICs, according to industry vendors and analysts at the 3rd annual International Wafer-Level Packaging Conference (Nov. 1-3 in San Jose, CA). Among the many presentations on WLP, packaging leader Amkor showed that this technology will soon be applicable to ~85% of all ICs by unit volume, and should see market growth of 25% CAGR over the next five years. Analysts presented details of the markets and applications driving this slow revolution in mainstream packaging.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.