Honeywell expanding packaging center

February 16, 2007 – Honeywell Electronic Materials, Tempe, AZ, says it will invest >$1 million to expand its advanced packaging materials R&D center in Spokane, WA.

The expansion, to be completed by the end of this year, involves adding ~85 new pieces of equipment for more work on thermal interface materials, including material mixing and characterization, analytical and application testing, thermal and reliability testing, and failure analysis.

Also planned is a new metrology lab to replicate customer manufacturing obstacles and test for solutions, the company said.


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