Palomar Microelectronics’ services include process development, prototyping, volume assembly, and test. (Photo: Palomar)

May 15, 2007 — Palomar Technologies, provider of precision automation equipment and process development for microelectronic assembly, now offers microelectronic packaging services through Palomar Microelectronics. This new segment of the company was inspired by growing demand for quick-turn product development, prototyping, test, and assembly services.

Palomar’s microelectronic assembly processes include advanced wire bonding, gold ball bumping, and precision component placement for semiconductor packages, high power LEDs, MEMS devices, microwave and RF components, optoelectronic packages, multichip modules, and hybrids.

Palomar Microelectronics will operate from Palomar’s headquarters in Carlsbad, California. Services include process development, prototyping, volume assembly, and test. Processes are developed by Palomar’s design, applications, and process engineers and validated on Palomar’s automated precision microelectronic assembly equipment. Once a process is refined and optimized, volume production is performed by Palomar Microelectronics.

“As an established manufacturer of capital equipment with thousands of systems operating in the field, Palomar is naturally positioned to support the scalable production of complex microelectronic devices at our own facility,” says company president Bruce Hueners.