Amkor, IMEC sign agreement for 3D WLP

July 18, 2007 – At SEMICON West, Amkor Technology Inc., a provider of advanced semiconductor assembly and test services, and IMEC, the independent nanoelectronics and nanotechnology research center based in Belgium, announced that they have entered into a 2-year collaboration agreement. They will develop cost-effective, 3D integration technology based on wafer-level processing techniques.

“This collaboration with IMEC will enhance our continuing efforts to develop low cost, state of the art packaging solutions for our customers”, said Dan Mis, Amkor’s senior VP for wafer level advanced product development.

Luc Van den hove, IMEC’s executive VP and COO, commented: “We are pleased that one of the leading semiconductor packaging service providers has joined our 3D system integration program that targets the development of post-passivation technology for 3D interconnects at the IC bond pad level.”


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