A new series of screen printable thick film materials from DuPont Microcircuit Materials, Bristol, UK, enables solar cell manufacturers to reduce their cost per watt by reportedly achieving higher cell efficiencies, higher production yields, and lower material consumption.
The Solamet thick film metallization product range developments have improvements in n-type emitter front side silver contacts, high coverage solderable tabbing silvers and silver aluminum inks, and low bow high electrical performing aluminum metallization. The new front side n-type silvers exhibit low contact resistance, high conductivity, high aspect ratio, and high print speed. Depending on the cell configuration, the new front side silver is also available in cadmium and lead-free variants.
For backside solder applications, there is silver metallization with lower material consumption, and good initial and soldered aged adhesion, employing leaded and lead-free solders.
The new material system is completed by a series of new Al compositions for wafer thicknesses down to 180-microns. The new Al compositions are designed for low bow below the industry standard of 1.5mm of 6 in. x 6 in. cell sizes.