(July 8, 2008) PHOENIX, AZ— Hermes, the Eurpoean consortia for the development and industrialization of embedded die technology, has partnered with Flip Chip International (FCI) to leverage the company’s proprietary embeddable die customization (EDC) technology to enable the consortium’s pursuit of heterogeneous systems integration.
The Hermes Consortia, launched on May 1, 2008, was established to span the supply chain, bringing together partners from the PCB, wafer processing, and test industries to enable the infrastructure for embedded die technology in the IDM and OEM markets. Coordinated by Austrian PCB manufacturer, AT&S, Hermes is expected to stimulate market pull.
According to Ted Tessier, CTO of FCI, the company has already supported the EU’s Hiding Dies program, which was the precursor to Hermes, and targeted EDC technology to provide part of the infrastructure necessary to support the migration of embedded die technologies from development through high volume production. The thin film redistribution options provided by EDC reportedly provides a standardized die preparation format required by Hermes embedded die.
“Hermes is the European answer to the active embedding activities in the far east,” explained Hannes Stahr, manager R&D technology implementation for AT&S. “We see supply chain management, standardization of components, design, and testing as the most critical topics that have to be solved in order to provide for a successful industrialization.”