Low-Force Test Contacts for NiPdAu-plated Packages

August 25, 2009 –Johnstech International Corporation released its new Low-Force XL Contacts for Pad ROL™100A Series and Pad ROL™200 Series Test Contactors for testing NiPdAu IC packages. The new solutions offer longer contact life, extended MTBA, improved continuity, extended load board pad life, and reduced cost of test when testing NiPdAu packages.
A significant percentage of IC packages are migrating from matte tin pads and leads to those using NiPdAu plating. The cost of pre-plated NiPdAu packages has decreased significantly over the last several years making NiPdAu a more cost-effective plating option. In addition, NiPdAu is an excellent alternative to matte tin, particularly when tin whiskering is a concern.

NiPdAu-plated IC packages can present testing challenges. Without the proper socket design, material, and forces, the extreme hardness of NiPdAu material will result in faster pin wear rate, higher spare pin usage and higher overall cost of test.

The new Johnstech Low-Force XL Contacts meet the challenges of NiPdAu packages by providing lower forces (20-30 grams per contact) and a self-cleaning wipe function to achieve longer contact life and higher performance than competitive socket technologies. The name “Low-Force XL Contact” denotes the eXtended Life that these new contacts provide on NiPdAu packages.

In addition to the extended contact life, customers will lower their cost of test significantly with the new Low-Force XL spares by saving 21% – 55%, depending on the quantity purchased and the product selected. The new Low-Force XL Contacts are also included in Johnstech’s SelecTest program, which benefits you by delivering load board documents at the time of quote, Contactor deliveries in less than 2 weeks, and lower acquisition cost.

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