June 15, 2012 – BUSINESS WIRE — Digital imaging technology company Canon U.S.A. Inc. introduced the FPA-6300ES6a deep ultra-violet (DUV) stepping scanner, a lithography tool with a KrF excimer laser light source for the high-volume production of memory, logic and image-processing devices.
The tool targets high productivity, precision, reliability and capacity utilization patterning dynamic random access memory (DRAM), flash and other memory; logic such as microprocessors; and color filters and other imaging sensor wafers. Canon recently introduced a lithography tool for advance packaging as well, the FPA-5510iV.
The FPA-6300ES6a model realizes 200 wafers per hour (WPH) throughput (300mm wafers, 98 shots with High-Throughput Upgrade Option applied), approximately 60% faster than its predecessor. The DUV scanner incorporates a newly designed Reticle Stage and Wafer Stage that achieve accelerated exposure processes, reducing exposure times. The wafer alignment sequence is also optimized, along with wafer handling
Overlay accuracy is 5nm thanks to sophisticated stage-control technologies, an improved alignment scope and precise temperature control, such as air-flow stabilization. To reduce image distortion, the FPA-6300ES6a adopts advanced synchronous controls and high-level damping technology to control Reticle and Wafer Stage vibration. It offers an advanced 0.86 numerical aperature (NA) projection optical system and several options for throughput and overlay.
The model also features improved base durability and maintenance requirements in the series.
Canon U.S.A. Inc. provides digital imaging solutions, with parent company Canon Inc. (NYSE:CAJ). Canon U.S.A. Semiconductor website: www.usa.canon.com/semiconductor_equipment.