Devan Iyer, director of Semiconductor Packaging in Texas Instrument’s Manufacturing Group, has joined the advisory board of The ConFab, a conference and networking event hosted by Solid State Technology and PennWell, focused on the economics of semiconductor manufacturing. As Director of TI’s worldwide semiconductor packaging operations, Dr. Mahadevan "Devan" Iyer oversees a global team that drives a process to determine the packaging design and technologies that best meet the requirements of TI’s customers in measures of miniaturization, performance, cycle time and cost.
With more than 25 years of experience in microelectronics and packaging, Iyer is a recognized authority on packaging technologies. He has published more than 180 technical publications, has 28 patents to his credit and is a frequent invited speaker at industry meetings and conferences.
The ConFab has a long history of covering advanced packaging and 3D integration, and welcomes Dr. Iyer’s insights.
In 2013, The ConFab will be held June 23-26 at The Encore at The Wynn in Las Vegas.