Toshiba to showcase leading-edge semiconductor solutions for mobile devices at Mobile Asia Expo 2013

Toshiba Corporation today announced that it will showcase its leading-edge semiconductor solutions for mobile devices at Mobile Asia Expo 2013. Toshiba will highlight solutions in five areas: "Smart Connectivity," "Smart Imaging," "Smart Audio," "Memory" and "Discrete," under the unifying concept "A Smart Future Starts from Toshiba Semiconductor Solutions."

Mobile Asia Expo 2013 will run from June 26 to June 28 at Shanghai New International Expo Centre (SNIEC) in Shanghai, China and Toshiba will be at booth N1.F78.

Outline of Toshiba’s Exhibition at Mobile Asia Expo 2013:

1) Smart Connectivity: Solutions that use various wireless environments, including near field communication technologies such as TransferJet(TM)and NFC, plus other technologies, among them FlashAir(TM), Bluetooth(TM), Wi-Fi(TM) and wireless charging.

2) Smart Imaging: System solutions including CMOS sensors and image processing technologies that help to create a safe and smart future.

3) Smart Audio: High quality, low noise, low power audio solutions, including a noise/echo canceller that brings clear communications to a variety of ever-changing user environments, such as audio and movie playback and device control through voice recognition.

4) Memory: High capacity memory products that enable users to store all sorts of data: music, movies, smartphone apps and more. The exhibit will also feature "SeeQVault(TM)", a next-generation content protection technology, which makes it possible to store high definition (HD) contents on memory cards.

5) Discrete: Discrete products in ultra-small packages, such as CSP, which support power management and high-speed interfaces on mobile devices. Products on display will include MOSFETs, load switches and ESD protection diodes.  


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