Tessera Technologies names Craig Mitchell as CTO and president of Invensas

Tessera Technologies, Inc. today announced it has named Craig Mitchell as chief technology officer for Tessera and president of Invensas Corporation, effective immediately. Mr. Mitchell assumes these roles from Simon McElrea, who is leaving the company for a new opportunity.

Mr. Mitchell, who was most recently the senior vice president of business development, joined the company in 1992 and has held a variety of senior roles in technology development, marketing, and licensing. He was a central figure in the development, licensing and technology transfer of the company’s flagship microBGA packaging technology to leading semiconductor manufacturers. Mr. Mitchell is also the named inventor on more than 60 U.S. patents.

In his new role, Mr. Mitchell will drive the development and commercialization of xFD, BVA, and 2.5D/3D interconnect technologies as well as efforts to expand the Invensas portfolio of interconnect technologies.

“Although I have been with the company for over 20 years, I am more excited than ever. The Company’s approach to technical collaboration and partnerships is consistent with our goal of driving enabling technologies, such as xFD and BVA, into high volume production with our customers. I look forward to working with our highly talented technology team to deliver the next generation of game-changing technologies to our customers,” said Mr. Mitchell.

“We are thrilled to have someone of Craig’s experience and abilities assume this important role within the company. Craig has a deep understanding of technology development combined with a collaborative approach to creating value for our customers. His leadership will be instrumental in achieving our future growth initiatives,” said Tom Lacey, Tessera’s CEO. “I would also like to thank Simon for his many contributions to the Company over the past four years. We wish him the very best in his new endeavors.”

Tessera Technologies, Inc. and its subsidiaries generate revenue from licensing to manufacturers and other implementers that use the Company’s technology in areas such as mobile computing and communications, memory and data storage, and 3-D IC technologies.


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