11/09/2006 The SAES Getters Group, a provider of getter technology for high vacuum applications, and SUSS MicroTec, a supplier of precision manufacturing and test equipment for the semiconductor and emerging markets, are working together to develop their technologies for wafer-level packaging applications for the MEMS industry.
11/09/2006 GenISys GmbH, a Munich, Germany, provider of software solutions for efficient processing of large layout data and optimization of microstructure fabrication, announced Layout BEAMER 2.0.
11/08/2006 Axsun Technologies Inc., a Billerica, Mass., manufacturer of MEMS-based micro-optoelectronic "spectral engines," announced the closure of a $15 million Series D financing round.
11/08/2006 Ecology Coatings Inc., an Akron, Ohio, developer of nano-engineered industrial coatings for cleaner, more efficient manufacturing, announced it has entered into a letter of intent with OCIS Corp. (OTCBB: OCIC.OB) to become publicly held through a reverse merger.
11/08/2006 Acacia Research Corp. announced that Acacia Patent Acquisition Corp., a wholly owned subsidiary that is part of the Acacia Technologies licensing group, has acquired rights to a patent relating to aligned wafer bonding technology.
11/08/2006 3DIcon Corp., a Tulsa, Okla., development-stage communications technology company, announced that University of Oklahoma researchers, under a sponsored research agreement, have filed a provisional patent application with the U.S. Patent and Trademark Office describing a display system that uses a combination of digital light processors and nanotechnology materials to create full-color, static volumetric, realistic 3D images that can be viewed from any unencumbered perspective.
11/08/2006 NanoDynamics Inc., a Buffalo, N.Y, diversified nanotechnology and nanomaterials manufacturing company, announced that it will introduce its new NDRevolution 50H portable hybrid solid oxide fuel cell system at the 2006 Fuel Cell Seminar in Honolulu, Hawaii.
11/07/2006 November 6, 2006 - The value of new fab construction will hit an all-time high of $59 billion in 2006, followed by another record next year in the value of fabs coming online to volume production, according to Strategic Marketing Associates (SMA).
11/07/2006 Researchers gathering for the National Nano Engineering Conference, in Boston November 9 – 10, will learn about how a NASA-developed innovative process is impacting nanotechnology.
11/07/2006 The wafer-level package (WLP) market picture that emerged from the IWLPC marketing session on November 2 is one of rapid change and high growth potential. Achieving growth rates depends on changing the present business model to meet the consumer-driven needs of the handheld-device market.
11/07/2006 November 7, 2006 - Keithley Instruments Inc. and French firm Mesatronic Group have signed a deal to develop advanced probe cards for semiconductor parametric testers used in RF and low current DC applications.
11/07/2006 IMEC, Europe's leading independent nanoelectronics and nanotechnology research institute, announced it has signed a memorandum of understanding with and the Indian Institute of Science in Bangalore as part of an effort to expand its R&D collaborations with Indian semiconductor companies and institutes.
11/07/2006 Researchers working on nanowires and compound semiconductors for next generation electronics reported at SEMI NanoForum in San Jose last week that they're getting practical results by turning their focus to relatively simpler applications, such as batteries and lighting.
11/06/2006 November 6, 2006 - European R&D consortium IMEC has signed memorandums of understanding with SemIndia and the Indian Institute of Science (IISc), moves that help solidify India's plans for developing into a semiconductor fabrication center, as well as IMEC's inroads into the region.
11/06/2006 November 6, 2006 - Intel Corp. and Micron Technology Inc., through their IM Flash Technologies JV, plan to build a new "multibillion-dollar" fab in Singapore to add a fourth manufacturing outlet for NAND flash memory. The 300mm/50nm facility is projected to come online in 2H08.
11/06/2006 November 6, 2006 - Israeli pure-play foundry Tower Semiconductor Ltd. has made available a new laterally diffused metal oxide semiconductor process (LDMOS) on its 0.18-micron platform, produced in its Fab 2 facility, targeting use in LCD drivers for cell phones and other handheld displays.
11/06/2006 IWLPC keynote speaker Wilf Corrigan, founder and chairman of LSI Logic, and a 40-year industry veteran, sees increasing system-in-package (SiP) advantages over system-on-chip (SoC) as wafer feature sizes continue to shrink and consumers demand rapid product changes.
11/06/2006 November 6, 2006 - Chinese flagship foundry Semiconductor Manufacturing International Corp. (SMIC) plans to slash 30% from its capital expenditures next year from this year's $1.0 billion, according to recent comments by chairman Richard Chang.
11/06/2006 Tessera Technologies signed a technology licensing agreement with European NXP B.V., formerly Philips Semiconductors. Under agreement terms, the semiconductor company licensed Tessera's packaging technology for use across its device portfolio.
11/06/2006 Synova, the Lausanne, Switzerland, maker of water jet-guided laser technology, announced that it has signed a letter of intent to develop a joint venture with Sugino Machine Ltd. in Japan to bolster its presence and market share in the Japanese micromachining equipment market.
