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Optoelectronics Packaging

09/01/2005  Despite the crushing blow dealt to the optoelectronics industry following the dot-com boom, research in the area continues because of the continuing allure of the benefits that technology promises.

Troubleshooting Underfill Void Elimination

09/01/2005  Methods for gaining reliability in underfill applications

IEEE 1451.4

09/01/2005  Facilitating Temperature Sensor Success

MEMS Packaging Update

09/01/2005  Providing a foundation for future packaging advancements

Building on a Basic X-ray Inspection Platform

09/01/2005  Configuring an X-ray Inspection System

A Breath of Fresh Air

09/01/2005  Someone once said that to do the same thing over and over while expecting a different result is the definition of insanity.

Advanced Packaging Salutes Innovative Excellence

09/01/2005  It is with great pleasure that once again, Advanced Packaging Magazine congratulated the participants and winners of the 2005 Advanced Packaging Awards (APAs).

ASE Receives Freescale's 2005 Supplier Recognition Award

08/31/2005  Santa Clara, Calif. — Advanced Semiconductor Engineering Inc. (ASE) has received a Supplier Recognition Award from Freescale Semiconductor. ASE was one of three companies presented with this award, which honors suppliers who have impacted Freescale's business significantly throughout the past 12 months.

NEC, Hitachi to sell part of stakes in Elpida Memory

08/31/2005  August 31, 2005 - Elpida Memory Inc. said yesterday its two largest shareholders, NEC Corp. and Hitachi Ltd., will sell part of their stakes in Elpida, a supplier of DRAM chips in Japan, during the current fiscal year to next March 31, reported Kyodo News International.

Molecular Imprints announces 300th patent filing

08/31/2005  Molecular Imprints Inc., a provider of nanoimprint lithography technology, announces the filing of the 300th patent application worldwide related to its S-FIL, or step-and-flash imprint lithography, technology.

Micronic Receives Order for Laser Pattern Generator from PPt

08/30/2005  Taby, Sweden — Micronic Laser Systems AB has received an order from Phoenix Precision Technology Corp. (PPt), an IC packaging photomask supplier and PBGA substrate producer, for Micronic's MP80+ multi-purpose, laser pattern generation system.

MEMC begins 300mm production in Taiwan

08/30/2005  August 30, 2005 - MEMC Electronic Materials Inc. says that it has become the world's first producer of 300mm wafers in Taiwan; production starts today at its Taisil facility in Hsinchu, Taiwan.

AMI, MOSIS partner for multi-project wafer and education programs

08/30/2005  August 30, 2005 - AMI Semiconductor has renewed its partnership with MOSIS, a prototype and low volume production IC fabrication service, to participate in the MOSIS multi-project wafer program and education program. These programs provide access to wafers for IC development, semiconductor prototyping, and test chips as an inexpensive method to prove out silicon to small businesses, start-ups, educational facilities, and other MOSIS customers.

Fabric - not pocket - protectors: Nano-Tex goes upscale

08/29/2005  In a sign that Nano-Tex fabric enhancements are heading upscale, a trio of fashion houses unveiled apparel enhanced with Nano-Tex treatments.

SEMI's Q2 '05 Worldwide Figures Reach $7.58B

08/26/2005  San Jose, Calif. — Worldwide semiconductor manufacturing equipment billings reached $7.58 billion in Q2 2005, SEMI reports. Billings are 19% below Q1 2005 and 21% below Q2 2004's figure. The data is gathered together with the Semiconductor Equipment Association of Japan (SEAJ) from more than 150 global equipment companies that provide monthly data.

Silicon wafer shipments back in business in 2Q05

08/26/2005  August 26, 2005 - Total worldwide silicon wafer area shipments rebounded nearly 10% in 2Q05 to 1606 million square inches (MSI), nearly even with levels from a year ago, thanks to increasing demand for 300mm and 200mm wafers, according to SEMI's Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

iNEMI Task Force Addresses Lead-free Issues

08/25/2005  Herndon, Va. — The International Electronics Manufacturing Initiative (iNEMI) has published recommendations for safeguarding high-reliability products' dependability as the supply chain converts to lead-free components and materials. iNEMI's High-reliability RoHS Task Force is calling for continued SnPb-compatible components availability for exempted products, and for standardized mitigation practices and testing methods to minimize tin whiskers.