08/24/2005 August 24, 2005 - Tokyo Seimitsu Co. has developed a special grinding and polishing procedure that can process silicon wafers down to a thickness of just 5 microns. The new technology opens the door on wafers that can bend like a piece of paper.
08/24/2005 Hong Kong and Pleasanton, Calif. — ASAT Holdings Limited announces that the Company's Board of Directors has appointed Robert Gange as president and CEO, effective immediately and succeeding Harry Rozakis.
08/23/2005 August 23, 2005 - Mitsubishi Sumitomo Silicon Corp. (SUMCO), a wafermaking JV between Mitsubishi Materials Corp. and Sumitomo Metal Industries Ltd., reportedly is considering filing an initial public offering later this worth about 100 billion yen (US$905 million), which would be Japan's second-biggest IPO.
08/23/2005 August 23, 2005 - Toshiba Corp. intends to raise its flash memory output to 150,000 units in terms of 300mm wafers in fiscal 2007, up 150% from the level to be reached next month, company sources said.
08/23/2005 Wilsonville, Ore. — Mentor Graphics Corp. is joining forces with the Electronic Design Automation Center at the China Academy of Science (EDA Center-CAS) in Beijing, China, to build a joint system-design laboratory.
08/23/2005 August 23, 2005 - Technologies and Devices International Inc. (TDI) has demonstrated indium nitride (InN) epitaxial layers and structures. Novel 2-inch diameter InN-on-sapphire templates and InN/GaN heterostructures will be featured at the 6th International Conference on Nitride Semiconductors in Bremen, Germany, from August 27 through September 3.
08/23/2005 August 23, 2005 - Canon Inc. said yesterday it will build a R&D center for a new flat panel display technology called SED, or surface-conduction electron-emitter display, in Kanagawa Prefecture, south of Tokyo, with an investment of 20.8 billion yen, according to JiJi Press.
08/22/2005 August 22, 2005 - AMI Semiconductor Inc. has announced its intention to consolidate its European wafer fabrication operations to enhance operating efficiencies. The company intends to close its 4-inch wafer fabrication facility in Oudenaarde, Belgium, and consolidate operations into its existing 6-inch wafer fab, also located in Oudenaarde. The consolidation and closure of the 4-inch facility is expected to be completed by 1Q07.
08/19/2005 San Jose, Calif. — In July 2005, and on a 3-month average, North American-based semiconductor equipment manufacturers posted $1.02 billion in orders and a book-to-bill ratio of 0.93, according to SEMI's July 2005 Book-to-Bill Report.
08/19/2005 August 19, 2005 - North American-based manufacturers of semiconductor equipment posted $1.02 billion in orders in July (three-month average basis) and a book-to-bill ratio of 0.93, according to the monthly Book-to-Bill Report published today by SEMI.
08/19/2005 August 19, 2005 - GE Global Research, the centralized research organization of the General Electric Company, has announced the development of an ideal carbon nanotube diode that operates at the "theoretical limit," or best possible performance.
