08/18/2005 Schärding, Austria and Singapore — EV Group announces lab-on-a-chip (LOC) research highlights achieved by their customer, Institute of Microelectronics (IME). IME wishes to develop a fully integrated LOC, also known as a Micro Total Analysis System (µTAS), which will perform the three functions of DNA/ RNA analysis — extraction, amplification (or multiplication), and detection in one chip. They forecast that this will be ready for commercial production in 2–3 years.
08/18/2005 Aug. 18, 2005 - Tessera Technologies Inc. has transferred its MicroBGA chip-scale packaging technology to the University of Alaska Fairbanks and to North Dakota State University. This licensing and transfer of technology is a part of the development of an advanced technology center on both campuses.
08/18/2005 August 18, 2005 - EV Group, Scharding, Austria, has announced lab-on-a-chip (LoC) developments achieved at its Singapore customer Institute of Microelectronics (IME).
08/17/2005 August 17, 2005 - Engineers at Sematech's Advanced Materials Research Center (AMRC), Austin, TX, are investigating a nanoscale approach to metrology that will allow them to examine new semiconductor structures at the atomic level, and so prepare the way for next-generation electronics.
08/17/2005 August 17, 2005 - Rohm and Haas Electronic Materials LLC and JSR Corp. have settled patent litigations in the US District Court for the District of Columbia and the European Patent Office related to the use of ethyl lactate solvent in photoresists. Under the settlement, the parties each obtained a worldwide patent license from the other party and acknowledged the validity of the patents.
08/17/2005 San Jose, Calif. — Worldwide silicon wafer area shipments increased 10% during Q2 2005 when compared to Q1 area shipments, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis. Total silicon wafer area shipments were 1,606 million sq. in. during the most recent quarter, up from 1,465 million sq. in. shipped during the previous quarter. The new quarterly total area shipments are 1% below Q2 2004 shipments.
08/16/2005 Palo Alto, Calif. — Amkor Technology has added multiple Agilent Technologies 93000 pin-scale systems to its existing installed base at its Korea and Singapore locations. In Korea, the pin-scale systems will test control and processing devices for digital media devices, and in Singapore, they are used for multi-site testing of controllers for wireless and mobile applications.
08/16/2005 August 16, 2005 - Technologies and Devices International Inc. (TDI) has announced the availability of novel 3-in. dia. semi insulating substrate materials for nitride-based semiconductor devices. The group-III nitride compound semiconductor material family includes gallium nitride (GaN), aluminum nitride (AlN), and their alloys. The GaN-based market is projected at least $5B for 2007 and more than $7B for 2009.
08/15/2005 Hollis, N.H. — Jeffrey P. Sercel, president of J. P. Sercel Associates, and co-author Michael von Dadelszen, Ph.D., have authored a chapter in the recently published book, Laser Beam Shaping Applications, edited by Fred M. Dickey, Scott C. Holswade and David Shealy. The chapter authored by Sercel and von Dadelszen, Chapter 3, is titled "Practical UV Excimer Laser Image System Illuminators," pp. 113-155.
08/15/2005 August 15, 2005 - Agilent Technologies Inc. has agreed to a series of actions, including divesting its semiconductor products segment for $2.66 billion, in order to ...
08/15/2005 Dallas, Texas — Texas Instruments (TI) is implementing its RoHS "Gold" strategy for its IC products to offer simple solutions to RoHS component transition challenges. RoHS "Gold" provides customers with nickel/palladium/gold (NiPdAu) leadframe-based products, eliminating tin whiskering, as well as unique part numbers for bill-of-materials (BOM) management and online access to key material content information at www.ti.com/ecoinfo.
08/12/2005 August 12, 2005 - Worldwide silicon wafer area shipments increased 10% during 2Q05 when compared to 1Q05 area's shipments, according to SEMI's Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.
08/12/2005 August 12, 2005 - Silicon foundry Taiwan Semiconductor Manufacturing Co. (TSMC) recently submitted a plan to construct a 300mm wafer fab and a technology-development center at the Central Taiwan Science Park to the park's administration, according to the Taiwan Economic News.
08/12/2005 Phoenix, Ariz. — WELLS-CTI recently upgraded their 0.65-mm-pitch 71X series CSP sockets by now molding them as opposed to machining them. With this, the company expects to support high-volume customers and improve lead times. The molded 0.65-mm-pitch products are now available in open-top and clamshell 715, 716, 717, and 718 CSP sockets.
