08/12/2005 Colorado Springs, Colo. — IC Interconnect (ICI), a wafer bumping service company, now offers lead-free wafer-bumping capabilities as a standard service offering in recognition of the EU's looming RoHS initiatives.
08/11/2005 August 11, 2005 - MOSAID Technologies Inc. and foundry UMC have announced that they are cooperating on the development of comprehensive double data rate (DDR)/DDR2 SDRAM memory controller semiconductor intellectual property solutions for UMC's 90nm and 130nm process geometries.
08/11/2005 Chandler, Ariz. — Amkor Technology and GEM Services have signed a broad, multi-year patent license agreement, allowing GEM to practice under Amkor's MicroLeadFrame (MLF) patents portfolio. MLF is Amkor's version of an IC package classified as a quad-flat-pack-no-lead (QFN), and is a leadframe-based, nearly chip scale package with an exposed die paddle and leads on the package's bottom.
08/11/2005 Phoenix, Ariz. — RoseStreet Labs (RSL) has opened their 3-D Research and Development laboratory for next-generation semiconductor packaging. Along with their subsidiary, FlipChip International, they will develop new materials and processes for packaging used in wireless products. Also, RSL's alliance with SUSS MicroTec allows RSL to use SUSS' full suite of lithography and 3-D packaging equipment in the new lab.
08/10/2005 August 10, 2005 - RoseStreet Labs (RSL), Phoenix, AZ, has announced the opening of its 3D Research and Development laboratory for next-generation semiconductor packaging, as well as an alliance with Suss MicroTec, which will provide the lab with a full suite of lithography and 3D packaging equipment.
08/10/2005 August 10, 2005 - Feinfocus, a Comet business unit and manufacturer of x-ray inspection systems, has entered into a technology alliance with Innov-X Systems, a Woburn, MA manufacturer of high-performance, portable x-ray fluorescence analyzers.
08/09/2005 Pittsburgh, Pa. — The MEMS Industry Group (MIG), a trade association representing the MEMS and microstructures industries, has added 9 new members during the second quarter of 2005 to its roster, including Boston Micromachines, Eyelit Inc., IceMos Technology, Makino, Meggitt Electronics, MicroBridge Technologies, SAES Getters, SiTime, and Tronics Microsystems.
08/08/2005 August 8, 2005 - IBM has announced the availability of its fourth-generation silicon germanium (SiGe) bipolar CMOS (BiCMOS) foundry technology, 8HP. The company reports that the new 130nm technology is applicable to markets such as automobile safety systems; 60GHz WiFi chips for wireless networks; high-speed A/D and D/A converters; and more.
