Category Archives: Wafer Level Packaging

March 14, 2011 — Unisem added 12" wafer probing to its test floor in Sunnyvale, CA.  Accretech’s next generation prober, the UF3000EX, offers high-speed wafer handling, a low-noise XY stage, and high accuracy with its OTS (Optical Target Scope) positioning technology. 

"The Accretech UF3000EX provides our factory with a state of the art system for wafer probe that will also give us the option to probe twelve inch wafers. Wafer probe has over the last year become a key part of our business in Sunnyvale," said Marita Erickson, general manager at Unisem Sunnyvale.

Unisem Sunnyvale is actively evolving its test floor with the latest test platforms and equipment, to more accurately reflect the test floors in its 3 high-volume Asia factories (Malaysia, Indonesia, and China), and allow customers access to new, top technologies. Unisem customers can grow business from development in Sunnyvale to volume production in Asia with the same equipment.

Unisem is a global provider of semiconductor assembly and test services (SATS), offering wafer bumping, wafer probing, wafer grinding, a wide range of leadframe and substrate IC packaging, wafer level CSP and RF, analog, digital and mixed-signal test services. Turnkey services include design, assembly, test, failure analysis, and electrical and thermal characterization. For more information about Unisem, visit www.unisemgroup.com

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March 14, 2011 — Molex Incorporated, interconnect supplier, has joined with other researchers to advance the goals of the Danish SAFE (Smart Antenna Front End) project. Scheduled to span four years, the $8.7 million project is being conducted by a consortium comprising Aalborg University, Intel Mobile Communications, WiSpry and Molex.

Through collaborative research and new product innovation, SAFE members aim to address communication bandwidth, standards, and antenna issues related to the global proliferation of mobile phone devices.

"Since the mid-1990s, we have struggled to get more bandwidth out of cheap antennas that cover a wide range of mobile communication bands and standards. The size of the antennas and RF components have grown, which is problematic, because the market demands smaller products. Adding more design building blocks reduces overall system performance. With the SAFE program we want to rethink and reinvent how industry solves these challenges," said Professor Gert Frølund Pedersen, head of the Antenna and Propagation section at Aalborg University.

Located in Aalborg, Denmark, the Molex RF Antenna Research team brings to the consortium a state-of-the-art facility and more than a decade of experience in mobile antenna development. Molex designs, develops and manufactures custom antennas and antenna assemblies that support a wide range of wireless communication technologies, including cellular, UMTS, WiFi, WIMAX, Bluetooth, GPS and others.

"We are embarking on necessary next steps in an evolution that began when mobile phone antennas were visible components that could be pulled out and replaced to improve performance," explains Morten Christensen, RF research manager, Molex. "The future is a standardized ‘one size fits all’ antenna system. We intend to create technology capable of handling all bandwidths and radio systems into one small unit that covers all the bands. It must be made in such a way that enables antennas to operate unaffected by user influence, whether they are integrated in a portable cell phone or device, laptop or tablet PC."

A significant project investor, the Danish National Advanced Technology Foundation attended the SAFE opening ceremony held in January at the Molex-Denmark facility. Based on a competitive grant application process, the Foundation offers private companies and universities the resources and framework for developing new and important technologies.

Managing director Per Hartmann Christensen, Intel Mobile Communications, Denmark, noted: "Until now, the development of RF and antenna has been separated, yielding less than optimal solutions. In this project, we have for the first time convened leading experts in a targeted effort to develop a specific control and integration technology for antenna and RF that can potentially be incorporated into all mobile phones in the future."

WiSpry, a leading global manufacturer of tunable RF solutions for mobile platforms, has established a new research and development center in Aalborg. "Our MEMS-based technology is the ideal solution to the demanding requirements of today’s multi-mode, multi-band, data-centric terminals, offering the highest performance of any tunable solutions on the market or in development today," adds WiSpry founder and CEO Jeff Hilbert.

Molex delivers complete interconnect solutions for a number of markets including data communications, telecommunications, consumer electronics, industrial, automotive, medical, military, lighting and solar. Established in 1938, the company operates 39 manufacturing locations in 16 countries. The Molex website is www.molex.com.

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March 11, 2011 – BUSINESS WIRE — Accel-RF Corporation, turn-key RF reliability testing systems maker for compound semiconductor devices, installed two advanced semiconductor reliability test systems for customers in Asia. The systems were delivered in Q4 2010 with installation completed in early January 2011.

Shipped to both government research and commercial entities, these systems will be instrumental in the development of compound semiconductor device performance characterization in Asia.

Service and first-line hardware support of these systems will be performed by Amtechs Corporation in Japan and SE Technologies in Taiwan.

"Following successful entry into the European Union (EU) last year, Accel-RF is excited to begin distributing our products to customers in Asia," says Roland Shaw, president and founder of Accel-RF. Accel-RF has been selling RF reliability test systems in the US since 2004.

Accel-RF Corporation specializes in the development, design, and production of accelerated life-test/burn-in test systems for RF semiconductor devices. Learn more at www.accelrf.com

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March 10, 2011 — Multitest, designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announced that a major fabless semiconductor manufacturer has evaluated and approved its Mercury-based wafer-level contactors for subcontractors in Asia.

Click to EnlargeMercury contactors have eight sites and over 25 spring probes per site. The contactors passed all qualification tests in the US and have now been deployed to multiple testing subcontractors in Taiwan and Singapore. Based on this successful evaluation, the manufacturer has awarded Multitest with two additional wafer-level chipscale package (WLCSP) projects. Several of the Asian subcontractors have experience with the Mercury technology and cite its long life, low maintenance requirements, and low replacement probe price.

Mercury probes have a bandwidth of approximately 20GHz, current-carrying capacity of over 2Amps, inductance of approximately 1nH, and life of over one million insertions at wafer level (values are pitch dependent).

For more information about Multitest’s Mercury-based wafer-level contactors, visit www.multitest.com.

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March 8, 2011 – BUSINESS WIRE — Optomec Aerosol Jet product manager Mike O’Reilly will give a presentation titled "Aerosol Jet Printing as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications" at the IMAPS (International Microelectronics and Packaging Society) Device Packaging Conference on March 9.

O’Reilly will discuss how, based on cost and functional advantages, the Aerosol Jet process is emerging as an effective alternative to traditional wire bond and through-silicon-via (TSV) technologies. Aerosol Jet systems have high-density 3D interconnect capabilities that enable multi-functional integrated circuits (ICs) to be stacked and vertically interconnected in high-performance system-in-package (SiP) devices. The die stacks can include 8 or more die, with a total stack height of ~1mm.

The printing system has a working distance of several millimeters, which means that no Z-height adjustments are required for the interconnect printing. Closely coupled pneumatic atomizers with multiplexed print nozzles are used to achieve production throughput of greater than >18,000 interconnects per hour, and high aspect ratio interconnects with 30µm line width and 6µm line heights have been demonstrated at sub 60µm pitches with low resistivity.

The presentation will also include pre-production qualification results, final production packaging, and further definition of the Aerosol Jet print platform integrated within a high throughput, manufacturing ready automation solution.

The IMAPS Device Packaging conference is being held March 8-10th at the Radisson Fort McDowell Resort and Casino in Scottsdale/Fountain Hills, Arizona. The seventh Annual Device Packaging Conference is an international event and attracts a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. The conference provides a focused forum on the latest technological developments in five topical workshop areas related to microelectronic packaging, including 3D IC & Packaging, Flip Chip Technologies, MEMS & Associated Microsystems, Wafer Level Packaging; and Emerging Technologies (LEDs & Passive Integration).

Optomec provides additive manufacturing technologies for high-performance applications in the electronics, solar, medical, and aerospace & defense markets. Learn more at www.optomec.com

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March 8, 2011 – BUSINESS WIRE — IMT, wafer level packaging (WLP) company and MEMS foundry, introduced its hermetic gold-to-gold (Au-Au) thermo compression bonding. In development for nearly a year, this bond is being actively used in production, and it is said to be one of the lowest cost methods of achieving a hermetic wafer level package bond.

Low-temperate, low-cost wafer bonding could benefit MEMS packaging, as well as other applications.

In addition to the Au-Au thermo compression and the other bond technologies supported, IMT’s flagship remains its proprietary low-temperature hermetic eutectic bond. With sealing temperatures below 190°C and support for reflow temperatures of more than 500°C, this bond is ideal for temperature-sensitive sensors or electronics that require a hermetic package. The bond line width is controlled at less than 50µm.

"More than 80% of our total business makes use of wafer level packaging," said John Foster, IMT Chairman and CEO.

IMT produces and develops MEMS devices and is a pure-play MEMS foundry in the United States. IMT designs, manufactures, tests and supplies products to the RF, biotech, biomed, optical communications, infrared, navigation and general markets servicing Fortune 500 companies as well as startups. For more information, visit http://www.imtmems.com.

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March 7, 2011 — The Institute of Microelectronics (IME), an institute of the Agency for Science, Technology and Research (A*STAR), and electronic defense systems company ELTA Systems Ltd. (ELTA), a group and a wholly owned subsidiary of Israel Aerospace Industries (IAI), have inked an agreement to design and develop a novel through silicon via (TSV) substrate technology for multi-chip module (MCM) packaging.

The collaboration will result in new applications in multi-chip modules in radar, communication, and electronic warfare systems. The new technology platform would enable miniaturization of wireless applications that are faster, lighter and can withstand higher temperatures.
 
"Our joint goal is to develop innovative manufacturing and design processes to address the challenges associated with the use of TSV substrate technologies. We expect the resultant technology to have a fundamental impact on the defense systems industry, and on a wider scale, the worldwide semiconductor packaging market," said Professor Dim-Lee Kwong, executive director of IME. IME offers capabilities in IC packaging design and wafer-level molding.

By providing high density, very fine pitch interconnects and better stress tolerance between the die and substrate, TSV substrate technology is increasingly viewed as a critical means of resolving the growing geometric and material incompatibility between printed circuit boards and ICs. Apart from the greater miniaturization they afford, TSV substrate technology also offers more flexibility and shorter time-to-market. IME has been spearheading the development of this disruptive technology through its TSV research program and the 3D TSV consortium it leads.

The Institute of Microelectronics (IME) is a research institute of the Science and Engineering Research Council of the Agency for Science, Technology and Research (A*STAR) in Singapore. Its key research areas are in integrated circuits design, advanced packaging, bioelectronics and medical devices, MEMS, nanoelectronics, and photonics. For more information, visit IME at http://www.ime.a-star.edu.sg. A*STAR is the lead agency for fostering world-class scientific research and talent for a vibrant knowledge-based and innovation-driven Singapore.

Israel Aerospace Industries Ltd. is a leader in the aerospace and defense industry and Israel’s largest industrial exporter. ELTA Systems Ltd., a group and wholly owned subsidiary of IAI, is one of Israel’s leading defense electronics companies specializing in intelligence, surveillance, target acquisition and reconnaissance (ISTAR); early warning command and control; homeland security (HLS); self-protection and self-defense, and fire control applications. Please visit www.iai.co.il for more information.

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March 3, 2011 — NuPGA Corporation has changed its name to MonolithIC 3D Inc. The company incorporated in 2009 with the mission to develop better programmable logic technology with density, speed, and power approaching ASICs. As it developed an improved FPGA technology, the NuPGA team discovered a path for practical monolithic 3D ICs. MonolithIC 3D Inc. changed its strategy to focus on monolithic 3D IC technology as a pure IP innovator organization.

MonolithIC 3D’s patented technologies offer chipmakers an economical and efficient way to create semiconductor chips in vertical "stacks" of circuit elements that delivers vertical connectivity 10,000 times better than the existing TSV-based 3D stacking. The company’s technologies have the potential to increase semiconductor device speed, lower power requirements, reduce silicon area, and be cost competitive with traditional dimensional scaling. 

MonolithIC 3D has filed more than 30 fundamental patent applications that cover the basic technology as well as significant applications of 3D IC technology.

"MonolithIC 3D’s technology can enable older fabs to use 3D IC to successfully compete in the mobile market. My hope is that by empowering the older process nodes to create better devices and products, we can reverse the NRE cost trend and ignite the ASIC market and device innovation," noted Zvi Or-Bach, founder of MonolithIC 3D.

The MonolithIC 3D team consists of semiconductor and semiconductor equipment industry veterans with deep experience in design innovation and collaborates with researchers at Stanford University, Rice University, and other research organizations. Learn more at www.MonolithIC3D.com

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March 2, 2011 – Marketwire — ALLVIA, through-silicon via (TSV) foundry, will present its latest analysis on silicon interposers and embedded capacitors during the IMAPS Conference on Device Packaging in Scottsdale, AZ, March 9. Dr. Sergey Savastiouk, CEO at ALLVIA, will present "Silicon Interposers Enable High Performance Capacitors."

The data presented in this paper will show that, after several thermal cycles, planar capacitors on silicon result in stable, reliable capacitors operating at very high frequencies. Planar capacitors in interposers don’t exhibit parallel resonance, an issue seen with chip capacitors. ALLVIA, on behalf of its foundry customers, has been conducting studies of various capacitors on silicon interposers.

Thin film capacitors without TSVs have been used previously. However, with high interconnect inductance, benefits of thin film capacitors have not been fully realized. TSV interposers with embedded capacitors provide the shortest electrical path between devices and power supply decoupling capacitors. TSVs provide very low inductance interconnects, enabling high electrical performance when integrated with embedded thin film capacitors.

ALLVIA has integrated embedded capacitors on silicon interposers, a key interface between a silicon device and an organic substrate needed for managing high interconnect densities. 3D integration with ALLVIA’s through silicon via technology allows much closer access to high value capacitors than previously possible, leading to a much higher level of electrical performance.

The International Microelectronics And Packaging Society (IMAPS) is the largest organization dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. IMAPS Device Packaging conference will be held at the Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, AZ, March 8-10, 2011.

ALLVIA is a through silicon via (TSV) foundry offering prototyping and full volume production of both front side and back side TSVs to the MEMS and semiconductor industries as well as silicon etching, copper plating, photolithography, CMP, etc. www.allvia.com

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March 2, 2011 – BUSINESS WIRE — NVIDIA Corporation (NASDAQ: NVDA) has licensed Inter-Chip Connectivity (ICC) technology from SMSC (NASDAQ: SMSC), a leading semiconductor company creating valued connectivity ecosystems.

ICC enables the USB 2.0 protocol, which is now standard in billions of electronic devices, to be delivered over short distances consuming a fraction of the power of a traditional USB 2.0 analog interface while retaining 100% software compatibility with an analog USB 2.0 connection. The High Speed Interconnect (HSIC) specification (an addendum to the USB 2.0 specification) incorporates ICC technology. Where applicable, such as in portable applications, the ICC technology dramatically decreases power consumption and silicon area compared to an analog USB 2.0 interface.

Using its ICC license with SMSC, NVIDIA can develop devices that are designed to be compliant with the HSIC specification for both USB 2.0 host and USB 2.0 device applications.

SMSC’s ICC technology is described in U.S. Patent No. 7,702,832, which was issued to SMSC on April 20, 2010. Additional related patent applications have been filed by SMSC in the United States and other countries. As provided for in the appropriate agreements, USB 2.0 promoters and companies that have timely signed both the USB 2.0 Adopters Agreement and a related HSIC amendment letter may license SMSC’s ICC technology patents under reasonable and non-discriminatory (RAND) terms. Further, SMSC’s ICC technology is now available to the industry at large through individually negotiated patent licenses from SMSC.

SMSC develops Smart Mixed-Signal Connectivity solutions. SMSC employs a unique systems level approach that incorporates a broad set of technologies and intellectual property to deliver differentiating products to its customers. The company is focused on delivering connectivity solutions that enable the proliferation of data in personal computers, automobiles, portable consumer devices and other applications. Additional information is available at www.smsc.com.

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