Category Archives: LEDs

The work, published this week in Nature Communications, details how electronic properties at the edges of organic molecular systems differ from the rest of the material.

Organic materials — plastics — are of great interest for use in solar panels, light emitting diodes, and transistors. They’re low-cost, light, and take less energy to produce than silicon. Interfaces — where one type of material meets another–play a key role in the functionality of all these devices.

“We found that the polarization-induced energy level shifts from the edge of these materials to the interior are significant, and can’t be neglected when designing components,” says UBC PhD researcher Katherine Cochrane, lead author of the paper.

‘While we were expecting some differences, we were surprised by the size of the effect and that it occurred on the scale of a single molecule,” adds UBC researcher Sarah Burke, an expert on nanoscale electronic and optoelectronic materials and author on the paper.

The researchers looked at “nano-islands” of clustered organic molecules. The molecules were deposited on a silver crystal coated with an ultra-thin layer of salt only two atoms deep. The salt is an insulator and prevents electrons in the organic molecules from interacting with those in the silver — the researchers wanted to isolate the interactions of the molecules.

Not only did the molecules at the edge of the nano-islands have very different properties than in the middle, the variation in properties depended on the position and orientation of other molecules nearby.

The researchers, part of UBC’s Quantum Matter Institute, used a simple, analytical model to explain the differences which can be extended to predict interface properties in much more complex systems, like those encountered in a real device.

“Herbert Kroemer said in his Nobel Lecture that ‘The interface is the device’ and it’s equally true for organic materials,” says Burke. “The differences we’ve seen at the edges of molecular clusters highlights one effect that we’ll need to consider as we design new materials for these devices, but likely they are many more surprises waiting to be discovered.”

Cochrane and colleagues plan to keep looking at what happens at interfaces in these materials and to work with materials chemists to guide the design rules for the structure and electronic properties of future devices.

Methods

The experiment was performed at UBC’s state-of-the-art Laboratory for Atomic Imaging Research, which features three specially designed ultra-quiet rooms that allow the instruments to sit in complete silence, totally still, to perform their delicate measurements. This allowed the researchers to take dense data sets with a tool called a scanning tunnelling microscope (STM) that showed them the energy levels in real-space on the scale of single atoms.

Entegris, Inc., a producer of yield-enhancing materials and solutions for highly advanced manufacturing environments, has expanded its wafer shipper family of products with the SmartStack (R) 300 mm Contactless Horizontal Wafer Shipper (HWS). The SmartStack 300 mm is the industry’s first contactless horizontal wafer shipper capable of holding a full lot of 25 wafers, almost twice the capacity of competitive wafer shippers. Entegris’ design departs from traditional interleaf inserts and foam cushions by using a perimeter support ring to contain wafers inside. The wafers are positioned so that they move in unison, preventing wafer-to-wafer contact and potential damage from impact.

“We designed an ideal solution for shipping and storing 25-lens bumped or thin wafers that offers improved safety over conventional wafer shippers,” said Entegris Product Marketing Manager, Doug Moser. “By placing the wafers on rings and removing the interleaf inserts and foam cushions, the wafers are protected from stains, imprints and scratches typically caused by these inserts. Additionally, the new design accommodates 25 wafers in one shipper, thereby increasing shipping density and lowering shipping cost 50% or more, compared with a conventional FOSB.”

The SmartStack 300 mm is designed to accommodate wafers of varied thickness (150 µm to 1100 µm), for a variety of applications including 3D, 2.5D, SoC, MEMS, LED and power semiconductors. The new design is also available in the 150 mm and 200 mm size. The automation-compatible features of the 300 mm HWS enable ease-of-use and limit manual intervention.

LG Innotek, a leading global materials and components manufacturer, today announced that the company started to produce high-power LED packages (H35C4 Series) featuring 180lm/W, which are the highest efficacy in the world.

LG Innotek improves the efficacy of high-power LED packages by 13% compared to the previous packages. The Company said that the H35C4 Series will be supplied to the global market in October.

LG Innotek used its proprietary vertical LED chip technology to optimize the manufacturing and mixing process of the fluorescent substance that produces the light for its LED chips, thus improving the performance of their LED packages. This performance is at least 10% better than all other competing products.

These LED packages boast a efficacy of 152lm/W at 85℃, 700mA under the actual usage environment of most LED packages. It beats the efficacy of competing products by 10lm/W or more.

Through optimizing “white conversion technology”, the lifespan of the product has also in-creased greatly. According to the expected lifespan based on LM-80, the LED lighting reliability evaluation criteria used by the US Environmental Protection Agency (EPA), the average lifespan of LG Innotek’s product is 150,000 hours. This is almost three times longer than existing products, which have a lifespan of 51,000 hours.

In addition, LG Innotek has established a product line-up that encompass all ranges of color temperatures and rendering, including warm white (2700K), neutral white (5000K), cool day-light (6500K), and High CRI (CRI>90). Customers can apply these products for their use in LED lighting.

LG Innotek will further stay focused on developing high performance and value product such as High Power LED Package featuring more than 5 watt and UV LED. The company also has a plan to enhance its LED lighting line-up for automotive as well mobile application.

DuPont Displays today announced the opening of a state-of-the-art, scale-up manufacturing facility designed to deliver production scale quantities of advanced materials that enable large-format, solution-based printed Organic Light Emitting Diode (OLED) displays. These materials are designed to help manufacturers develop OLED displays that are brighter, more vivid, longer lasting and significantly less expensive than the OLED TVs on the market today. The facility is located at the DuPont Stine-Haskell Research Center (Stine-Haskell) in Newark, Del., near DuPont’s global headquarters in Wilmington.

“Materials are critical to the performance of an OLED TV and we are confident that DuPont has the best performing solution OLED materials available in the market today,” said Avi Avula, global business director, DuPont Displays. “Our vision is that OLEDs will become the display standard and to make that vision a reality, we are focused on helping our customers bring the cost of large sized OLED TVs down to less than $1000 by 2020.”

DuPont’s new scale-up facility is sized to meet the future growth expectations of the OLED TV industry, which analysts predict will increase by over 70 percent for the next several years and will require large quantities of highly sophisticated OLED materials. DuPont has been developing its suite of advanced OLED materials for the last 15 years. These materials are highly regarded for both solution and evaporative applications due to their long lifetime and deep color. In addition to its recently announced collaboration with an inkjet equipment maker to advance solution printed displays, DuPont is actively engaged with the leading OLED display manufacturers to bring solution printed OLED technology to market as quickly as possible.

DuPont’s new OLED facility at Stine-Haskell has large-scale formulation systems and can support simultaneous production of multiple product lines. It was designed with a focus on employee safety, environmental responsibility and producing superior quality materials with the highest possible purity. The project was partially funded by a grant from the state of Delaware in 2012, with DuPont investing more than $20 million in the facility.

DuPont Displays brings more than 15 years of experience in enabling evaporative and solution-based OLED technologies through advanced materials that deliver the color, efficiency and lifetime performance that display manufacturers and consumers demand. DuPont offers highly engineered, next-generation OLED materials as well as solution process know-how that makes the promise of lower cost OLED technology commercially feasible for TVs and other large-format displays.

BY JEFF DORSCH, Contributing Editor

Taiwan Semiconductor Manufacturing kicked off its Open Innovation Platform (OIP) Ecosystem Forum with thanks – not for another beautiful day in Silicon Valley, but for the collaborative work it does with its customers, suppliers, and other industry partners.

Rick Cassidy, the foundry’s senior vice president and president of TSMC North America, kicked off the all-day event in Santa Clara, Calif., saying he wanted to debunk the myth of the “lone creative genius” in the chip business. “It is a lot of geniuses working together,” he said. “Innovation happens collectively.”

While there has been much attention paid to the slowing growth in the smartphone market, mobile technology will continue to be a significant driver for the semiconductor industry, according to Cassidy. He reviewed the areas of mobile technology, the Internet of Things, and automotive electronics.

“IoT will require an incredible amount of interconnection technology,” Cassidy said.

Between IoT and automotive tech, there will be “a very significant amount of data that’s going to be needed to be stored and processed,” he added.

Cassidy emphasized TSMC’s relations with its many collaborators, large and small. “We’re a pure-play foundry,” he said. “We do not have any products.”

He added, “Nobody does yield better than TSMC.”

Cassidy noted that TSMC will spend more than $2.2 billion this year on research and development, compared with more than $1.9 billion last year. The foundry’s capital expenditure budget for 2015 is $10.5 billion to $11 billion, up from $9.5 billion in 2014, he added.

The opening session also heard from Jack Sun, TSMC’s vice president of R&D and chief technology officer, and Cliff Hou, vice president of the R&D design technology platform, as well as executives of Avago Technologies and Xilinx, two TSMC customers.

This article was originally published on SemiMD.com, part of the Solid State Technology network.

Flip Chip technology is expected to reach $25 billion market value and wafer demand of 32 million (12” eq. wafers) in 2020, supported by the wider adoption of Cu pillar technology. That growth will be led by Moore’s law pushing beyond the 28nm node and “More than Moore” evolution in next generation DDR and 3DICs.

flipchip_marketfigures_yole_oct2015_433x280The “More than Moore” market research and strategy consulting company Yole Développement’s (Yole) new analysis is entitled Flip Chip Technologies & Markets Trends (October 2015, Yole Développement). In this new report, Yole proposes a deep-added value analysis of the Flip Chip markets, players’ dynamics, and key trends. The consulting company highlights the key market figures and presents future Flip Chip strategy evolution and opportunities. Strongly linked to the Cu pillar technology, Flip Chip solutions have been largely adopted towards the mobile-wireless, consumer and computing applications, including continuous growth in the LED and CMOS Image Sensor (CIS) segments.

“Flip Chip assembly technology provides various benefits such as high I/O counts, fine pitch interconnection, and superior electrical and thermal performance,” explains Thibault Buisson, Technology & Market Analyst, Advanced Packaging at Yole. And he adds: “This drives its application across specific segments.”

The maximum growth in flip-chip bumping capacity will come from Cu pillars, driven by the finer pitches, higher I/O counts, lithography nodes below 28nm, emergence of 2.5D/3D packaging, increased current density and thermal dissipation needs. In the meantime lead-free solder bumping is expected to grow at just 2% CAGR as OSATs and foundries converting their existing solder bumping lines to Cu pillar lines. With the scaling of the Flip Chip pitch, OSATs are presently pushing the envelope of C2 mass reflow bonding with capillary underfill to pitches as low as 50µm by formulating engineered materials and improving assembly processes. However, if the pitch reaches or falls below 40µm Thermo Compression Bonding (TCB) will be the key option because of its high placement accuracy.

TCB will be adopted first in high volume manufacturing by IDMs like Intel, who can bear the high cost of ownership, followed by memory suppliers for their next generation memories based on through-silicon via technology.

“Intel has recently qualified ASM’s high throughput TCB bonder for assembly of 14nm chips for their CPUs in applications such as data centers, servers, and high-end computing”, comments Santosh Kumar, Senior Technology & Market Analyst, Advanced Packaging at Yole. And he adds: “At Yole, we estimate Flip Chip bonders’ total market value will reach US$435 million in 2020, with a CAGR of 7%. Flip Chip bonders and underfill materials will become key in coming years.”

A screen-printable functionalized graphene ink supplied by Goodfellow performs better than normal carbon-based ink, opening the door to innovative applications that require exceptional electrical conductivity, excellent ink coverage, and high print resolution. Such applications are found in light flexible displays, plastic electronics, printed circuit boards, thin film photovoltaics, sensors, electrodes, and OLEDs.

The ink is made with HDPlas (R) functionalized graphene nanoplatelets and is optimized for the viscosity and solid contents required of semi-automatic and manual screen-printing equipment. Substrates that can be printed include but are not limited to polymers, ceramics, and papers.

In addition to the distinguishing characteristics stated above, functionalized graphene ink is:

  • Flexible on appropriate substrates
  • Metal-free, 100% organic (non-tarnishing)
  • Curable at low temperatures
  • Environmentally friendly

The ink is fully customizable and can be modified for specific applications. Scientists and printers running trials with the small quantities available from Goodfellow (100g to 1000g) can, if desired, consult with Goodfellow to further tailor performance in order to meet individual needs.

Transparency Market Research (TMR), a market intelligence company based in the U.S., projects the global organic electronics market to grow at a CAGR of 32.6% from 2012 to 2018. The report, titled “Organic Electronics Market – Global Industry Analysis, Market Size, Share, Growth and Forecast 2012-2018”, is available on the company website for sale. The TMR study points out that the organic electronics market has tremendous potential in the fields of display technologies and electronic circuits, and is expected to register high growth rates in the coming years. The growth of the organic electronics market will be boosted by a combination of OLED lighting, OLED displays, OFRID, and organic photovoltaics.

As per the TMR study, the displays segment held the largest share of the organic electronics market. For the purpose of the study, the displays segment is segregated into electrophoretic, OLED displays, and other displays. Of these, OLED displays are projected to lead the organic electronics market and are projected to be worth US$10,450 million by 2018. This is due to their low energy consumption, high-speed performance, and sharp display features. Further, the study found the electrophoretic sub-segment is projected to be worth US$3,950 million by 2018, growing at a CAGR of 58.4% for the study period. Additionally, the continuous expansion of end-use applications beyond OLED lighting, OLED displays, and organic photovoltaics (OPV) is responsible for the robust growth of the global organic electronics market, as per the study analysis. Moreover, RFID labels and logic and memory are increasingly becoming the prime focus for OE manufacturers due to the high usage of these segments in the organic electronics market.

TMR’s findings show organic electronics will mostly be newly created rather than used as a replacement for other existing electronics, which will drive the growth of the market. Moreover, organic electronics, in spite of being capable of complemented with conventional silicon electronics, have the ability to produce flexible circuits. Owing to this trait, organic electronics have a rapidly increasing application base for flexible displays such as intelligent textiles, RFID labels, e-paper, bio-sensors, and intelligent packaging.

For the purpose of the study, the global organic electronics market is segmented into Asia Pacific, the U.S., Europe, and Rest of the World (RoW). In the geographical scenario, Asia Pacific is expected to lead the organic electronics market by revenue till 2018. As per the TMR research findings, Asia Pacific will boast a 50% share of the total revenue of the global organic electronics market in 2018 and will be followed by Europe.

In response to the current crisis in confidence brought on by revelations of misreporting of emissions levels by a major multinational car manufacturer, Edwards Ltd and its subsidiaries (Edwards), the leading supplier of exhaust management abatement systems to the Semiconductor, Flat Panel Display, Solar and LED industry, reassures its customers that all of its exhaust management abatement system products are designed to meet industry emission standards.

“Environmental responsibility is one of our top priorities at Edwards,” states Paul Rawlings, Vice President Marketing, Semiconductor & DSL Business Unit. “We take great pride in adhering to high standards in our worldwide manufacturing facilities, as well as in all the products that we make. All of our exhaust management abatement systems have been independently verified in use according to internationally recognised methods and standards, including those set by the United States Environmental Protection Agency and other national and international regulatory bodies.”

Paul Rawlings adds, “The recent news and controversy about a German car company apparently deliberately designing its products to evade emissions tests is very surprising and serves as a reminder of the need to always verify testing methodologies when reviewing performance data. As a global leader in the design and manufacture of exhaust management abatement systems for the electronics industry we want to reassure our customers that all of our abatement products comply with internationally recognized standards and that protecting the environment from harmful gasses is a responsibility we all share – across all industries, and across all borders.”

As a response to meet the increasing demands (higher heat/brightness characteristics) of cutting-edge LED technologies, Shin-Etsu Silicones of America (SESA), a U.S. subsidiary of Shin-Etsu Chemical Co. Ltd. of Japan, has recently introduced its new optically clear LIMS (Liquid Injection Molding System) X-34-1972-3 material.

With a transparency of 95%, the new material is ideal for expanding LED applications in street lighting, automotive, and exterior illumination. Notably, its high temperature resistance, compared to thermoplastic resins, allows molded silicone optics to be positioned in close proximity to the LED light source without yellowing or cracking over extended operating life spans.

According to SESA’s North America Marketing Manager, Eric Bishop, “Next-generation HBLED systems are getting hotter as light output continues to increase. The advanced engineering properties of our X-34-1972-3 material delivers unparalleled heat resistance and clarity at these higher operating temperatures.”

Bishop also noted that the material has been tested in-house and at customers with promising results.

The optically clear LIMS X-34-1972-3 material will be on display during SESA’s open-house demonstration at their LIMSTM Technical Center in Akron, Ohio on Monday, October 12 (1:00 pm – 5:00 pm). The informal event will feature the production of 100% silicones magnifying lenses and the opportunity to network with industry suppliers and associates.

X-34-1972-3 properties:

  • Viscosity (A/B): 450/450 Pa.s
  • Hardness: 70 A
  • Tensile Strength: 7.5 MPa
  • Tear Strength: 12kN/m
  • Refractive Index: 1.41
  • Transparency: 95%