Category Archives: SST

eMemory, an embedded non-volatile memory (eNVM) provider, and United Microelectronics Corporation, a global semiconductor foundry, today announced an expanded technology cooperation to integrate eMemory’s one-time-programmable (OTP) and multiple-time-programmable (MTP) embedded non-volatile memory technologies into UMC’s 28nm process. The agreement will broaden the foundry’s specialty process portfolio that already includes a range of eMemory eNVM IP solutions from 0.18um and below.

eMemory President Dr. Rick Shen pointed out, "We are happy to take our important strategic partner UMC to a higher level. We stand by our core principles of ‘embedded wisely, embedded widely,’ as we incorporate our core technologies into UMC’s process platforms. This represents the integration of the strengths of both companies and will allow us to provide our IC design clients eNVM platforms that boast quality and reliability, thereby enabling them to stay ahead of the rest of the market."

eMemory’s eNVM technologies target a wide range of applications in mainstream consumer electronics, including power management ICs for smart phones and tablet computers, advanced LCD drivers, touch panel controllers, battery management, sensor controller, audio codec, and near field communications. The current silicon IP (SIP) include NeoBit, NeoFuse, NeoMTP, NeoFlash, and NeoEE, making eMemory the top provider in the industry for providing a full array of SIP products for both OTP and MTP eNVM technologies.

eMemory’s MTP technology can be applied for different product needs including <10 times programming, low-medium or medium-high densities with high endurance requirements, and multiple-time-programmable embedded non-volatile memory technology applications. Furthermore, the technologies are highly compatible with logic processes for different process generations, making eMemory an ideal partner for wafer foundries seeking seamless eNVM integration into their process platforms.

UMC is a global semiconductor foundry that provides advanced technology and manufacturing for applications spanning every major sector of the IC industry. UMC’s foundry solutions allow chip designers to leverage the company’s leading-edge processes, which include 28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of Phases 1-4 which are in production for customer products down to 28nm. Construction is underway for Phases 5&6, with future plans for Phases 7&8. The company employs over 15,000 people worldwide and has offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States.

eMemory was established in August, 2000, and has focused on logic process eNVM silicon IP development. eMemory currently has about 200 employees.

 

Freescale Semiconductor, Ltd. appointed Krishnan Balasubramanian to its board of directors in May 2013.

Mr. Balasubramanian (known as Bala) brings more than 37 years experience in the semiconductor industry to his new role on Freescale’s board of directors. Bala currently serves on the board of MetroCorp Bancshares, Inc. and has previously served in a number of executive positions at Texas Instruments and has experience in manufacturing, technology development and business leadership.

“As an independent director, Bala brings a valuable outside perspective along with a deep understanding of the global semiconductor industry,” said Dan McCranie, Freescale’s chairman of the board.

“Bala’s experience with executive management supervision, regulatory matters and technological operations in the semiconductor industry makes him a welcome addition to our board,” said Gregg Lowe, Freescale’s president and CEO. “We look forward to his many contributions to the board.”

Freescale Semiconductor is a provider of embedded processing solutions. The company is based in Austin, Texas, and has design, research and development, manufacturing and sales operations around the world.

CEA-Leti announced today that researchers Dominique Vicard and Jean Brun received the Avantex Innovation Prize for the use of the E-Thread technology in textiles.

The award was presented June 10 during the award ceremony at the opening of the Techtextil and Avantex Symposia in Frankfurt, Germany.

According to Avantex, the “innovation awards go to outstanding achievements in research, new materials, products, technologies and applications.”

E-Thread is a microelectronic packaging technology developed by Leti that allows for a direct connection of a chip to a set of two conductors, which can provide the functions of antenna, power and/or data bus. This allows a 10x improvement in size, assembly time and reliability compared to classic microelectronic packaging. The E-Thread assembly can then be incorporated inside a yarn and used by the textile and plastic industries using standard production tools. Electronics such as LEDs, RFIDs or sensors can then be truly integrated in materials and objects.

In choosing this technology for the innovation award, the Avantex jury said “electronics integrated in textiles during the textile processing and not simply by adding the components in a last step will be a significant step forward.” The jury also said the prize was awarded to “this development, as it shows that research and development is also for the textile industry of vital importance and that it can lead to the creation of new companies.”

E-Thread is one of the technologies used within the European FP7 PASTA project (Platform for Advanced Smart Textile Application), and is the key technology asset of the Primo1D startup company, that will be created by Leti during the second half of 2013.

Vicard previously won a 40,000-euro startup award from OSEO, the French organization committed to supporting entrepreneurship, for proposing embedding electronic functions in textile yarns using the E-Thread technology.

Samples of E-Thread will be on display during the symposia, Hall 3.1, stand B11.

Fujitsu Laboratories Limited has launched millimeter-wave transceiver based on gallium-nitride high-electron mobility transistor (GaN HEMT). The device operates at frequencies up to the millimeter-wave band and features an output of 10W.

Until now, developing high-output modules that operate in the millimeter-wave band have required modules consisting of separately packaged components to allow for sufficient heat dissipation. As a result, it has been difficult to produce compact modules. In addition, because the occurrence of signal loss tends to increase in internal module terminal connector components at higher frequencies, reaching millimeter-wave operations has proved to be challenging.

The new high-output millimeter-wave transceiver module developed by Fujitsu uses a heat sink embedded with multi-layer ceramic technology capable of efficiently dissipating heat. Through its unique architecture that reduces signal loss occurring in internal terminal connector components, the transceiver module can achieve millimeter-wave operations. With dimensions of 12mm × 36mm × 3.3mm, the new module measures less than one-twentieth the size of a conventional combined unit.

Using the new technology, it is possible to combine multiple chips within a single unit, thereby enabling the development of more compact radar devices and wireless communications equipment.

Fujitsu Laboratories plans to put this technology to use in a wide range of applications that require compact modules with high output across wide bandwidths, including wireless devices and radar systems.

Building on its extensive microscope lineup, KEYENCE Corporation has released a new multipurpose microscope. The VHX-700F allows users to leverage some of the advanced functions of the VHX Series, such as Depth Composition and 3D Display, while offering the same image quality and primary measurement capabilities at a lower price point.

The VHX-700F incorporates observation, measurement, and image recording capabilities into a single device, while offering all of the imaging techniques found in traditional inspection equipment. The microscope boasts a 0.1x – 5,000x magnification range and provides bright field, dark field, and transmitted illumination. Additional attachments offer polarized, diffused, and DIC imaging methods. Users can also inspect inside of small openings with a complete lineup of borescopes and fiberscopes.

By combining the technology generally found in stereoscopic, metallurgical, measurement, and scanning electron microscopes, the VHX-700F is able to accentuate the strengths of these systems while avoiding many of their limitations. Not only can images be captured entirely in focus with the exceptionally large depth-of-field, but a variety of measurements can be completed directly on the image with just a click of the mouse. A multi-angle stand is paired with a rotating stage to allow 360 degree views without the need to fixture or manipulate the sample, and the camera easily detaches for handheld, non-destructive imaging of larger parts.

Silicon Labs, a provider of high-performance, analog-intensive, mixed-signal ICs, today announced that it has signed a definitive agreement to acquire Energy Micro AS. Based in Oslo, Norway, the late-stage privately held company offers the industry’s most power-efficient portfolio of 32-bit microcontrollers (MCUs) and is developing multi-protocol wireless RF solutions based on the industry-leading ARM Cortex-M architecture. Energy Micro’s energy-friendly MCU and radio solutions are designed to enable a broad range of power-sensitive applications for the Internet of Things (IoT), smart energy, home automation, security and portable electronics markets.

The growth of the IoT market, coupled with continued deployment of smart grid and smart energy infrastructure, is driving strong demand for energy-efficient processing and wireless connectivity technology to enable connected devices in which low-power capabilities are increasingly important. Industry experts predict that the number of connected devices for the IoT will top 15 billion nodes by 2015 and reach 50 billion nodes by 2020.

“Silicon Labs and Energy Micro share a complementary vision of a greener, smarter, wirelessly connected world, and the foundation for this combined vision is ultra-low-power technology enabled by each company’s innovative mixed-signal design,” said Tyson Tuttle, president and CEO of Silicon Labs. “This acquisition combines two proven leaders in nano-power MCU and wireless SoC design into a formidable force that will accelerate the deployment of energy-friendly solutions across the Internet of Things and smart energy industries.”

The company expects the addition of Energy Micro’s EFM32 Gecko MCUs and EFR Draco Radios, ultra-low-power technology expertise, energy-aware Simplicity development tools, and world-class design and applications teams will drive the rapid expansion of its Broad-based business. Silicon Labs intends to apply these complementary embedded technology platforms and expertise to enable the industry’s most energy-efficient solutions for the burgeoning IoT and smart energy markets, as well as the proliferation of battery-powered portable electronics devices. In addition, both companies’ 32-bit MCU and wireless products leverage the same ARM Cortex-M architecture, which is expected to accelerate the combined roadmap and support rapid adoption among the existing customer base.

“The Energy Micro team is excited to join Silicon Labs,” said Geir Førre, president and CEO of Energy Micro, who after the closing, is expected to become vice president and general manager of Silicon Lab’s Energy-Friendly Microcontroller and Radio business unit, based in Oslo. “Silicon Labs’ excellent resources and technology will help the combined company develop new products and gain market share more quickly.”

Olympus this week announced the release of the LEXT OLS4100 laser confocal microscope system. Designed to deliver nanometer-level imaging, accurate 3D measurement, and outstanding surface roughness analysis, the OLS4100 features auto brightness and a new high-speed stitching mode.

 

Engineered to meet a growing demand for increased measurement precision and wider observation applicability, the OLS4100 offers advanced measurement performance at ten-nanometer resolution with a variety of user-friendly performance parameters. Thanks to high numerical apertures and a dedicated optical system that obtains maximum performance from a 405 nm laser, the OLS4100 can reliably measure acute-angled samples that were previously impossible to measure.

“Widely used in quality control, research, and development across an array of industries and applications, OLYMPUS LEXT laser microscopes set a new standard in 3D laser microscopy,” said Matt Smith, Olympus director of sales and marketing. “Today, with the LEXT OLS4100, Olympus is once again raising the bar with a new level of precision and ease of use.”

The OLS4100’s auto brightness setting is part of an automatic 3D image acquisition system that allows even first-time users to quickly acquire 3D images with the click of a button, greatly reducing image acquisition time. A new high-speed stitching mode allows the user to specify target areas from wider-area stitched images. 

The OLS4100 employs a dual confocal system that, when combined with its high-sensitivity detector, enables the capture of clear images from samples consisting of materials with different reflectance characteristics. In addition to the laser image, the OLS4100 uses a white LED light and a high-color-fidelity CCD camera to generate clear, natural-looking color imagery comparable with that obtained with high-grade optical microscopes. This color image can be overlaid upon the 3D laser image for a 3D representation of your sample.

The OLS4100’s new multilayer mode is capable of recognizing the peaks of reflected light intensities of multiple sample layers and setting each layer as a focal point, making it possible to observe and measure the upper and lower surfaces of a sample with a transparent coating. This multilayer mode also facilitates the observation and measurement of multiple layers of transparent materials.

Calibrated in the same way as contact surface roughness gauges, the OLS4100 represents a new level of surface roughness measuring and adheres to the necessary roughness parameters and filters required per ISO and JQA. This allows users with contact surface roughness gauges to obtain output results from the OLS4100 consistent with their existing instruments, with the advantage of greater speed and non-contact measurement.

Engineered with easy operation in mind, the OLS4100 facilitates a systematic workflow through an intuitive interface that allows even novice users to quickly master measurement procedures. A wide range of measurement modes are available, each designed to efficiently enable specific analysis results. No pre-processing of samples is necessary.

Shipments of television sets in the United States declined by 11 percent in the first quarter of 2013 compared to one year earlier, according to a TV Systems Intelligence update from information and analytics provider IHS.

U.S. TV shipments dropped to 6.6 million units, down from 7.4 million a year ago in the first quarter of 2012. Liquid-crystal display televisions (LCD TV) decreased by 7 percent, while plasma plunged 39 percent, as presented in the attached figure.

However, the news was not all bad: The average selling price (ASP) for LCD TVs increased 3 percent, driven by a recovery in consumer confidence and a focus on replacing main TV sets with more full-featured products and larger screen sizes.

The fall in the United States reflected the worldwide decrease of television shipments during the first quarter. However, global TV shipments declined far lower, down by less than 2 percent.

The contraction in global volumes was driven by the decline in the remaining markets for bulky analog cathode ray tube (CRT) sets as well as by the reduction in plasma demand. Other factors responsible for the decrease included a widespread cutback in LCD TV manufacturing volumes by major Japanese vendors, and a repositioning of the market toward fewer, larger-sized TV sets in the mature markets.

Consumers spend more as feature demand increases

As a result of the ASP increase for LCD TVs, revenue was relatively stable by comparison, with total TV revenue dropping by 11 percent in line with total shipments, while LCD TV revenue declined significantly less than shipments, by 4 percent.

For brands relying on the LCD market, this creates an opportunity to expand their margins in the highly competitive TV market.

“The U.S. market is starting to reposition toward higher-end TV sets,” said Veronica Thayer, analyst for consumer electronics & technology at IHS. “Now that most homes have at least one flat-panel TV, consumers have become more discerning in their tastes and place more value on features like light-emitting diode (LED) backlighting, supersized screens and interactive smart TVs.”

Supersized LCD TVs and LED lead the way

Supersized LCD TV sets larger than 50 inches in the diagonal dimension accounted for 27 percent of U.S. LCD TV unit shipments in the first quarter, up from 15 percent one year before.

Furthermore, these large sets represented over half of all U.S. LCD TV revenue, at 53 percent, up sharply from 39 percent one year earlier.

For top television manufacturers, such high-cost sets represent an opportunity to maintain pricing despite declining unit sales in the United States.

Primarily because of increased shipments of 50-inch and 60-inch sets, the ASP for LCD TVs in the United States increased year-on-year in the first quarter. The ASP stood at $704, up from $682 one year earlier.

Meanwhile, LED-backlit sets increased their share of U.S. TV unit shipments to 72 percent, up from 37 percent during the first quarter of 2012. LED sets accounted for 76 percent of total TV revenue, up from 52 percent.

Samsung and Vizio remain the top US TV brands in Q1

In terms of competitive positioning, Samsung Electronics Co. Ltd. earned the highest revenue from the U.S. market for all types of televisions and in the key LCD TV segment, despite strong gains by Vizio Inc.

South Korea’s Samsung during the first three months of 2013 accounted for 31 percent of overall U.S. television market revenue, up from 30 percent during the same period in 2012. The company also expanded its share of U.S. LCD TV revenue to 28 percent, up from 27 percent one year earlier.

Meanwhile, Vizio increased its share of TV revenue sharply, rising to 16 percent, up from 11 percent in 2012. The U.S.-based company also boosted its portion of U.S. LCD TV revenue to 18 percent, up from 14 percent one year earlier, due to the increase in number of large-screen-size TV models offered, particularly the very successful 60-inch, and helped by the brand’s entry into Best Buy.

In terms of volume, the squeeze on the total number of shipped TVs still favored Samsung, with 1.6 million units in the first quarter this year. However, Vizio managed to edge out Samsung on U.S. LCD TV volume during the period by a few thousand units.

“Samsung has retained its position as the leading premium television brand in the United States by capitalizing on demand for premium features, but Vizio is making strong moves in volumes and larger-sized models, although its current revenue is still lower,” Thayer added. “Ultimately, feature-rich sets and large screen sizes lead to higher TV ASPs, which can provide an opportunity for manufacturers to regain margins.”

 

Advanced packaging technology is undergoing dramatic changes as the smart phones and new sensor technologies demand continued improvements in form and function.  To address these massive changes, SEMICON West will feature a number of programs on new packaging technologies and processes with speakers from leading chip makers, equipment manufacturers, and material suppliers.

According to IDC, forecasts semiconductor revenues will log a compound annual growth rate (CAGR) of 4.1 percent from 2011-2016, but revenues for 4G phones will experience annual growth over 100 percent for the same period. NanoMarkets estimates that the global market for “Internet of Things” sensors will reach $1.6 billion this year and grow to a value of $17.6 billion by the end of the decade as sensors become increasingly connected to the Internet directly or through hubs.  Both trends will significantly impact semiconductor and microelectronics packaging.  Demand for equipment and related tools in the 3D-IC and wafer-level packaging area alone is forecasted to grow from approximately $370 million in 2010 to over $2.5 billion by 2016, according to Yole Developpment.

To address these changes, SEMICON West 2013 (register at www.semiconwest.org/registration), held on July 9-11 in San Francisco, will feature a number of programs on new packaging applications, requirements, technologies, and products, including:

  • Generation Mobile:  Enabled by IC Packaging Technologies — Speakers from ASE, UBM Tech Insights, Amkor Technology, SK Hynix, and Universal Scientific Industrial will present on the latest advances in wafer-level packaging, new materials, and multi-die integration, including new System-in-Package (SiP) and Package-on-Package (PoP) methods. Location: Moscone Center (North Hall), TechXPOT North, Tuesday, July 9, 10:30am-12:30pm.
  • “THIN IS IN": Thin Chip & Packaging Technologies as Enablers for Innovations in the Mobility Era — IEEE/CPMT will hold a technical workshop on the overall trend of maximum functional integration in the smallest and thinnest package with lowest packaging costs with speakers from Intel, Cisco, ASE, Micron, SK Hynix, Nanium, Kyocera and more. Location: San Francisco Marriott Marquis, Tuesday, July 9, 1:30-4:45pm.
  • Advancing 2.5D and 3D Packaging through Value Engineering — Speakers from Altera, Amkor, ASE, ASET, KPMG, UMC, STATS ChipPAC and more will take a critical look at 2.5D implementations and the current outlook for 3D packages, including tools and technologies for heterogeneous stacks. Location: Moscone Center (North Hall), TechXPOT North, Wednesday, July 10, 1:00-3:30pm.
  • MEMS & Sensor Packaging for the Internet of Things— This session will feature speakers from all parts of the ecosystem to address how future visions of a pervasive interconnected world will be realized through the heterogeneous integration of MEMS and ICs.  The program will feature keynote speaker Janusz Bryzek from Fairchild Semiconductor, and speakers from VTT Research, Fraunhofer IZM, Robert Bosche, EV Group, Dai Nippon Printing, and more. Location: Moscone Center (North Hall), TechXPOT North, Thursday, July 11, 10:30am-1:00pm.

In addition to the packaging programs, SEMICON West 2013 will also feature over 560 exhibitors with the latest innovation on microelectronics manufacturing, including over 150 exhibitors with equipment and technology solutions for advanced packaging.  Other programs and exhibitors at West will address lithography, advanced materials and processes, silicon photonics, test, LED and MEMS manufacturing, and other subjects.  For more information on SEMICON West and to register, visit www.semiconwest.org

CEA-Leti will present recent advances and a preview of future developments in micro- and nanotechnologies, followed by workshops on key technical fields, during Leti Innovation Days, June 25-28, on the MINATEC campus.

The gathering incorporates Leti’s two-day Annual Review, now in its 15th year. That event provides an update of developments from Leti’s labs and its success in transferring technology to industry.

The 15th Annual Review kicks off on June 25th with two plenary sessions:

  • Envisioning the Future, chaired by Leti CEO Laurent Malier, will include insights from industry leaders into the technological innovations that will shape the future.
  • Enabling the Future, chaired by Pierre-Damien Berger, Leti VP of business development and communication. Presentations will include Leti’s latest developments and the key enabling technologies that will drive advancements in a broad range of sectors.

June 26th presentations by Leti specialists and partners will cover security and safety, environment and health, green IT and nanoelectronics.

“This year’s review powerfully highlights the wide-ranging strengths of Leti’s offer, from continuous innovation to technology transfer and support for SMEs,” said Leti CEO Laurent Malier. “Leti last year demonstrated a new FD-SOI solution that offers a 40 percent improvement in power consumption and a 30 percent frequency improvement, at lower costs. Transferred to manufacturing, it delivered the first application processor product dedicated to smartphones exceeding 3 GHz. We also particularly expanded our actions for SMEs, with a specific initiative allowing them to benefit from the expertise of our researchers and engineers and to access our state-of-the-art equipment.”

The Annual Review will be followed on June 27-28 by five in-depth workshops on design for 3D, memory, photonics, imaging and nanopackaging.

Leti Innovation Days participants will include international and European decision-makers: CEOs, CTOs, marketing and strategy directors, R&D managers, IT and semiconductor companies, innovative SMEs, end-user companies, research institutes, startups and international press. Represented industries include advanced microelectronics, green IT, memory, imaging, LEDs and lighting, safety and security, and healthcare and the environment.