Category Archives: Semicon West

by Phil LoPiccolo, Editor-in-Chief, Solid State Technology

SEMI’s new mid-year 2007 capital equipment revenue forecast, unveiled during its annual opening day press conference at SEMICON West 2007 in San Francisco, predicts sharply reduced growth projections for the next three years, compared to figures released in the association’s year-end 2006 forecast.

SEMI’s prior forecast estimated overall market growth rates of 3.7% in 2007, 13.3% in 2008, and 5.4% in 2009. But now, in its latest Capital Equipment Consensus Forecast, based on recent interviews with leading equipment suppliers, the group projects slower growth rates in all three years of its forecast — dipping to 1.1%, 6.5%, and 4.4%, respectively, over the same three-year period.

Despite the dampened forecast, SEMI president and CEO Stan Myers, pointed out that 2007 would be the second largest year ever for sales of new equipment, growing to approximately $41 billion (after surging 23% last year), thanks to continued investment in 300mm technology and growing investment in 45nm tools. He added that annual sales should reach $45.5 billion in 2009 and grow another 6.6% in 2010 to top $48.5 billion.

Wafer-processing equipment segment is seen experiencing the most significant level of growth this year (3.5% to $29.7 billion), while the market for assembly and packaging will remain flat at $2.5 billion, and sales for test equipment will drop significantly (-7.8% to $5.9 billion), according to the mid-year forecast.

By region, growth in the Taiwan equipment market (20.4% to $8.8B billion) is predicted to outdistance everyone else during 2007, followed by China (14.5% to $2.6 billion) and Korea (0.8% to $7.1 billion). Japan’s growth is expected to rise slightly (0.2% to $9.2 billion), while declines are expected in North America (-8.8% to $6.7 billion), Europe (-8.7% to $3.3 billion), and the rest of the world (-13.8% to $3.2 billion).

Looking ahead into 2008, Taiwan is seen adding another 8.5% in sales to reach $9.5 billion, second in total revenue only to Japan ($9.6 billion), while nearly all other regions are expected to experience single-digit growth. China’s annual equipment revenues are actually projected to decline in 2008 (-3.4%), though it should enjoy bountiful growth in 2009 (35.9%) and 2010 (13.4%), bringing annual equipment sales to $3.9 billion by the end of the decade. At that point, China would surpass Europe ($3.75) and move out of last place in terms of revenue among all regions. — P.L.

(July 16, 2007) SAN FRANCISCO &#151 The exhibition at SEMICON West, July 17–19 in San Francisco, hosts product introductions and demonstrations, technical talks, networking events, and other happenings. Following are the tradeshow offerings from IMEC, Antares, Cymer, NY Loves Nanotech, Kyzen, and X-tek.

(July 16, 2007) SAN FRANCISCO &#151 Discera, Inc., chief technology officer (CTO) Wan-Thai Hsu will present “The New Heart Beat for Electronics &#151 MEMS Oscillators,” at the Emerging Technologies and Markets TechXPOT, July 18, during SEMICON West, July 16–20 in San Francisco.

(July 13, 2007) BILLERICA, MA &#151 GE Sensing’s HygroTrace moisture meter will be highlighted in the Technology Innovation Showcase (TIS) during SEMICON West, July 16–20 in San Francisco. The meter uses aluminum oxide sensors with a proprietary process technology, which allows the conventional sensors to make faster, more accurate measurements of moisture percentages in high-purity gases.

SEMICON West Preview


July 13, 2007

(July 13, 2007) SAN FRANCISO &#151 SEMICON West, July 16–20 in San Francisco, will feature more than 1,250 exhibitors in the Moscone Center from the 17th, highlighting new products, processes, and materials. Following are products to look for at the show from Juki, FINETECH, CHAD Industries and Asymtek, Kester, and Wentworth Labs.

Juki Corporation, headquartered in Morrisville, NC, will showcase the CX-1 advanced placement system at Booth 8021. It enables placement of flip chips, system-in-package (SiP) and bare die alongside standard SMT pick-and-place actions. The system, built on the base of a standard SMT machine, uses reportedly high-accuracy glass linear encoders and specialized software, which periodically checks and calibrates placement accuracy.

CHAD Industries (Anaheim, CA) will display its WaferMate300 wafer handling system at Asymtek’s (Carlsbad, CA) Booth 7357. The companies have collaborated to provide a fully automated solution for wafer-level manufacturing, wherein Asymtek’s Axiom X-1020 system integrates with the WaferMate300 wafer handler to enable wafer-level underfill processing. The handler will also be displayed at CHAD’s Booth 8414.

FINETECH, based in Berlin, Germany, is exhibiting the CRS 10, a compact rework system, at Booth 7634. It offers a semi-automated, four-stage rework cycle with remove, clean, reball, and replace steps. The system suits small- to medium-scale series assembly or high-precision rework of soldered components on medium to large SMD boards. Lead-free approved, the system includes minimized operator influence on the process, 10-&#181m accuracy, and QFN/MLF in-situ paste printing.

Itasca, IL-based Kester will display TSF-6852 lead-free, water-soluble, tacky soldering flux at Booth 7364. TSF-6852’s synthetic ingredients are said to eliminate naturally occurring raw materials typically found in fluxes, maximizing lot-to-lot consistency. The flux is room-temperature stable, and can be dropped in as a replacement for low-melting-point alloys, conventional tin/lead eutectic, and higher-temp lead-free alloys. It can be reflowed under air or nitrogen and reportedly leaves solder joints shiny post-reflow.

To address scaled-up pin counts and density on current- and next-generation probe cards that result from increased chip power, Wentworth Labs (brookfield, CT) created a vertical probe technology, Accumax, that handles up to 6&#215 the current power level per probe, according to the company. The technology achieves high-density probe pitches for testing leading-edge multi-core processors. Designed to allow individual probe replacement in-field, the tester includes several possible enhancements over current technology. The company will exhibit at Booth T13 and representative Bob Rogers will present a customer case study on the 17th during SEMICON’s Technology Innovation Showcase.

For more on SEMICON, visit SEMI’s website, and see our SEMICON Product Preview in the May/June issue.

by Debra Vogler, senior technical editor

Members of the SIA’s Anticounterfeiting Task Force (which includes 16 companies) and SEMI’s International Standards program are working together to address a growing need in the electronics industry: counterfeiting of electronics components. Companies that try to address this problem find themselves in a double bind — not only do they lose money when counterfeit components enter the supply chain, but companies’ brand equity can suffer as well if the fraud becomes public knowledge.

While manufacturers of high-value components, such as microprocessor chips, typically have serialization and other means by which end users can authenticate the product, the technology being discussed by the SIA and SEMI members is different and efforts are first being directed at the lower value components, such as resistors, capacitors, etc., at the package level.

David Brown, senior principal engineer of security and product fraud countermeasures at Intel, is a member of the SIA committee investigating the authentication issue, and spoke with WaferNEWS about the proposals. “We [panel members] have found a generic way to validate/authenticate product that is independent of brand,” he said, noting that the method is also independent of product and could also be applied to other industries, e.g., medical, pharmaceuticals, and military. Because the SIA is not a standards organization, however, the members decided to ask SEMI for assistance in turning their idea into an industry-wide standard.

Their proposed solution: a unique security identifier, attached like a “license-plate” onto bulk packaging of electronic components (e.g., trays or tubes of chips, reels, even on retail boxes). Anyone in the supply chain can check the products’ authenticity simply through an Internet database portal, explained Elliott Grant, president/CEO of YottaMark, which is one of the suppliers of the proposed technology platform (see sidebar).

Key to the standards effort, Brown said, is getting the proposed technology adopted by law enforcement officials on a global basis, initially targeting lower-cost electronics components at the package level. That, he believes, would encourage manufacturers of high-value/complex components (e.g., microprocessors) to consider adopting the new system as well. “If there were an industry standard for authenticating electronic components, and law enforcement agencies around the world were looking for codes as the method for validating product, there is a possibility we would jump on that bandwagon,” he said. Brown noted that the proposed counterfeiting standards solution wouldn’t supercede existing efforts that Intel and others already do to “serialize” their complex devices, but “we might use it [the new technology] on top of that.”

Moreover, it simply would make good business sense to adopt such an industry-wide, global solution, Brown added, offering a scenario in which customs gets cleared faster because of the use of codes. “If that were the case, we would almost certainly adopt it because clearing customs faster means money,” he said. Added benefits to manufacturers include empowering consumers to avoid tainted product, devaluing the tainted product, and raising the value of the good product.

Bettina Weiss, director of international standards at SEMI, told WaferNEWS that SEMI’s North American Traceability Committee will be discussing the scope of proposed standards development for authentication of electronic components at SEMICON West. The counterpart standards committee within SEMI Japan has already been contacted and Weiss expects involvement from other regions as well in a global effort. Aside from whether to adopt the technology as a standard, other issues that need to be addressed by the standards organization are who administers the authentication technology and who manages the database. — D.V.

A yotta’s a “lotta” code space

The implementation being proposed by the joint SIA/SEMI panel and to be considered at the standards meetings at SEMICON West, involves placing highly encrypted codes associated with product and manufacturing information into the packaging or carriers used to transport resistors, capacitors, etc. “The unit of commerce (tray, tube of chips, reel of components, etc.) gets a unique identifier based on encryption methods that are now widely tested and secure,” explained Elliott Grant, president and CEO of YottaMark one of the authentication service providers (ASP) serving on the panel. “Third party companies — the ASPs — provide large quantities of highly encrypted code to product manufacturers who apply the codes to the unit of commerce.” The code can be checked by anybody anywhere in the supply chain, he noted.

The company’s name, “YottaMark,” says it all. A yotta = 1024, and is the size of the code space available to users of the company’s technology. According to Grant, security codes can be checked using the Internet, SMS, a hand-held scanner, or even a camera phone.

The significance of having a method based on a public standard vs. “secret” methods, such as holograms, or hidden tags, is that anyone can easily check authenticity. “The more data points you get, the more people checking codes, the stronger the system becomes…both as a detection method to detect counterfeits more quickly, and as a deterrent,” Grant explained. “Counterfeiters are much less likely to put bad product into the supply chain if they know people are checking.”

Besides YottaMark, two other major ASPs — Verify Brand and TUV Rheinland — are participating in the standards effort. Grant believes that other ASPs will emerge going forward. — D.V.

July 5, 2007 – Fresh off its recent acquisition of UK-based Epichem Ltd., a provider of high-purity chemicals (e.g. precursors for high-k materials), Sigma-Aldrich is focusing on silicon and compound semiconductor markets, touting a beefed-up division’s product roadmap at SEMICON West. Execs talked with WaferNEWS ahead of the announcements, about the company’s direction, its focus on collaboration, and how to justify value in an increasingly consumer-oriented industry where lower prices mean tighter investment evaluations.

SAFC is Sigma-Aldrich’s custom manufacturing and services division focusing on inorganic materials, accounting for about ~30% of total group’s $1.8 billion in sales — 12% of that ~$550 million is SAFC Hitech, of which two-thirds comes from Epichem. Starting in 2000 SAFC began redirecting efforts to dedicate facilities, sales/marketing, and other processes to different customers, and now the expansion with Epichem is an effort to diversify away from, and provide some balance to, the group’s other core market of pharmaceuticals, noted Frank Wicks, SAFC president. Epichem had previously been the beneficiary of backing from Intel Capital, back in late 2005.

Specifically for the semiconductor industry, SAFC sees penetration in a range of areas, including CVD precursors, barrier layers, high-k dielectrics for advanced gate stacks, low-k dielectrics for IDL applications, and specialty coatings. Geoff Irvine, SAFC’s director of R&D, told WaferNEWS the company sees two insertion points in the silicon industry for the company’s products: collaborative joint development projects for completely new materials, and simply supplying a known chemical to support the supply chain. For example, an improved corrosion inhibitor can be added into an existing CMP slurry set.

SAFC Hitech emphasizes the importance for materials suppliers to be increasingly collaborative with customers, and the need for a much clearer communication interface, noted Irvine. SAFC had a direct access to device manufacturers’ electronics value chains, with a good manufacturing footprint — but lacked customer interfaces with applications development teams, he noted. Those are brought to the table by Epichem, which has deep ties to compound semiconductor manufacturing (e.g., TMI, TMA, and materials with very low oxygen content), but lacked the means to achieve rapid scale-up and commercial manufacturing, Irvine said. Together, SAFC Hitech has “all the pieces put together,” he said: a strong customer interface, application development capabilities to talk with customers and tune products to their needs, and process development and manufacturing scale-up footprints.

Maintaining a collaborative supply relationship from development to manufacturing also helps the supplier make its case for the value of its products/services, a key sticking point particularly in the materials side of the semiconductor equation, Irvine suggested. “Transparency of the supply chain is critical,” he told WaferNEWS. “The end market needs to understand the value of where it’s created.” With the chip industry becoming ever more consumer-based (and seeing ASPs driven down), the need to justify value is increasingly weighted toward early development among suppliers, he said. “The only way to fight that is to address customers directly, what drives their motivations in the marketplace. When you are “supplier 1-5″ operating in the background, you’re not getting very much information back.”

For example, a devicemaker may want a molecule that integrates well in a gate stack, and Solution A is its top choice offering the best desired characteristics, but it’s not economically viable to manufacture for the supplier. A chemicals supplier with a collaborative model, however, might be able to suggest going in the direction of Solution B instead, where results may be close but not quite as good, but margins will be more attractive on a materials basis, and more easily scaleable in manufacturing.

Irvine noted that SAFC Hitech has picked up new business from the Epichem deal, e.g., high-brightness LEDs, and is now selling into silicon -based logic, ASICs, CPUs, and even solar. Work involves thin-film deposition materials, such as liners for both frontend and backend processing. “We get a lot of inquiries for collaborations, but we have to be careful what we take on board,” vs. what promises can be fulfilled, he noted.

Other major work at SAFC Hitech involves high-k dielectric materials, another area where a collaborative, clear-communicative relationship with customers is key, since it looks like several different high-k material flavors will be required, depending on process characteristics (e.g., different DRAM architectures) and end applications (e.g., high-power or low-power/mobile devices), meaning manufacturing not just one hafnium material, but maybe two or three, Irvine noted. Not to mention increasing challenges with exotic and niche materials and in volume amounts, e.g. for adhesion to aid in diffusion barriers.

One area offering promise to chemicals and materials developers is “combinatory discovery”, a technique pioneered for drug discovery that promises to speed up the process for finding and characterizing new structures. Early adopters of this method include Dow Chemical, which claims significant benefits in terms of R&D speed and efficiency. SAFC’s Irvine said that although it’s an attractive model for a market such as semiconductors with very long cycle times and extensive capital costs, it’s still difficult to get materials to the proof-of-concept stage. “We’re all still hoping” for the promises of combinatory discovery, but it hasn’t really been embraced, he noted. — J.M.

By Jeffrey C. Demmin, contributing editor

Are you ready for SEMICON West? The biggest tradeshow in the industry is just around the corner, and here are some highlights of what might be of interest to the packaging professional.

Our series of product and event previews leading up to SEMICON West 2007, July 16–20 in San Francisco, continues with summaries of exhibits from Micro Control Company, Hyphenated Systems, Siemens, Ultratech, DfR Solutions, JPSA, Synopsys, and more.

SEMICON West Preview


June 7, 2007

SEMICON West will take place July 16–20 in San Francisco, bringing together equipment suppliers, SATS providers, R&D institutes, and related companies in the semiconductor packaging industry to highlight new processes, systems, and packages.