Device Architecture

DEVICE ARCHITECTURE ARTICLES



ASE and TDK announce plans for joint venture agreement

05/08/2015  Driving towards market leadership in setting the industry standard for semiconductor miniaturization in portable and wearable consumer devices.

Visualizing formation in BEOL

05/07/2015  New tests show in real-time that cracks can run on top of and through metal layers.

Enhanced thermal management solutions for RF power amplifiers

05/06/2015  Synthetic diamond heat spreaders and GaN-on-Diamond wafers have emerged as a leading thermal- management technology for RF Power Amplifiers.

Co-design of chips, packages and boards

05/06/2015  A new product from Mentor Graphics called Xpedition® Package Integrator provides a new methodology and platform in addition to a new suite of EDA tools.

Silicon Storage Technology, GLOBALFOUNDRIES announce qualification of automotive grade 55nm flash memory tech

05/05/2015  Microchip Technology Inc., through its Silicon Storage Technology subsidiary, and GLOBALFOUNDRIES today announced the full qualification and availability of SST’s 55nm embedded SuperFlash non-volatile memory on GLOBALFOUNDRIES’ 55nm Low Power Extended (LPx)/ RF enabled platform.

Improving organic transistors that drive flexible and conformable electronics

05/05/2015  A revolution is coming in flexible electronic technologies as cheaper, more flexible, organic transistors come on the scene to replace expensive, rigid, silicone-based semiconductors, but not enough is known about how bending in these new thin-film electronic devices will affect their performance.

MagnaChip announces management changes

05/04/2015  MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that Tae Young Hwang has resigned as the Company's Chief Operating Officer and President and from all other officer and director positions.

New study suggests that rapid innovation in semiconductors provides hope for better economic times ahead

05/04/2015  A new study coauthored by Wellesley economist, Professor Daniel E. Sichel, reveals that innovation in an important technology sector is happening faster than experts had previously thought, creating a backdrop for better economic times ahead.

SEMATECH and Exogenesis form strategic alliance to commercialize accelerated neutral atom beam tech

05/04/2015  SEMATECH and Exogenesis Corp. have agreed to a strategic alliance to commercialize Exogenesis' Accelerated Neutral Atom Beam (ANAB) technology and their nAcceltm accelerated particle beam equipment platform.

Intel and the Department of Science and Technology launch the "Innovate for Digital India Challenge"

05/01/2015  Intel in India reinforced its commitment to the Government of India's Digital India vision with the announcement of the Intel and DST "Innovate for Digital India Challenge", which will focus on the creation of products to increase technology adoption in India that will eventually result in the creation of a local technology ecosystem.

Mentor Graphics releases design solutions for the independent engineer

04/28/2015  Mentor Graphics Corporation this week announced the delivery of three new PADS family products starting at five thousand dollars to address the advancing needs of the independent engineer.

Applied Materials and Tokyo Electron terminate merger

04/27/2015  The decision came after the U.S. Department of Justice (DoJ) advised the parties that the coordinated remedy proposal submitted to all regulators would not be sufficient to replace the competition lost from the merger

Silicon Motion announces agreement to acquire Shannon Systems

04/24/2015  Silicon Motion Technology Corporation, a developer of NAND flash controllers for solid state storage devices, today announced that it has entered into a definitive agreement to acquire Shannon Systems.

Surface matters: Huge reduction of heat conduction observed in flat silicon channels

04/23/2015  A paper published in ACS Nano describes how the nanometre-scale topology and the chemical composition of the surface control the thermal conductivity of ultrathin silicon membranes.

UGA chemists' synthesis of silicon oxides opens 'new world in a grain of sand'

04/23/2015  In an effort that reaches back to the 19th-century laboratories of Europe, a discovery by University of Georgia chemistry researchers establishes new research possibilities for silicon chemistry and the semiconductor industry.

From metal to insulator and back again

04/23/2015  New work from Carnegie's Russell Hemley and Ivan Naumov hones in on the physics underlying the recently discovered fact that some metals stop being metallic under pressure.

Communications, computer systems drive IC sales across all regions

04/23/2015  Automotive systems forecast to remain a major application in Europe.

How emerging IoT impacts the semiconductor sector

04/23/2015  In this 50th year anniversary of Moore’s Law, the steady scaling of silicon chips’ cost and performance that has so changed our world over the last half century is now poised to change it even further through the Internet of Things.

North American semiconductor equipment industry posts March 2015 book-to-bill ratio of 1.10

04/22/2015  A book-to-bill of 1.10 means that $110 worth of orders were received for every $100 of product billed for the month.

Synopsys' modeling of 10nm parasitic variation effects ratified by open-source standards board

04/21/2015  Synopsys, Inc. today announced new extensions to its open-source Interconnect Technology Format (ITF) which enable modeling of complex device and interconnect parasitic effects at the advanced 10-nanometer (nm) process node.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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