Device Architecture

DEVICE ARCHITECTURE ARTICLES



China IC production forecast to show a strong 15% 2018-2023 CAGR

02/08/2019  However, China’s indigenous IC production is still likely to fall far short of government targets.

Governor Cuomo announces IBM investment to create artificial intelligence hardware center at SUNY Poly Albany campus

02/07/2019  Governor Andrew M. Cuomo today announced that IBM, a long-time anchor tenant at the SUNY Polytechnic Institute campus in Albany, plans to invest over $2 billion to grow its high-tech footprint at the campus and throughout New York State.

UC Riverside physicists create exotic electron liquid

02/04/2019  The first production of an electron liquid at room temperature opens the way for new optoelectronic devices and basic physics studies.

Global semiconductor sales increase 13.7% to $468.8B in 2018

02/04/2019  Global demand for semiconductors reached a new high in 2018, with annual sales hitting a high-water mark and total units shipped topping 1 trillion for the first time.

KLA-Tencor appoints Victor Peng to Board of Directors

02/01/2019  KLA Corporation today announced the appointment of Victor Peng to its board of directors.

Mobile Semiconductor introduces a new 55nm high density memory compiler especially designed for IoT devices

02/01/2019  Mobile Semiconductor announced a new 55nm HD (High Density) memory compiler targeted at the cost sensitive IoT market.

Broadcom joins Semiconductor Industry Association

01/31/2019  The Semiconductor Industry Association today announced the addition of Broadcom Inc. as an SIA member.

Intel names Robert Swan CEO

01/31/2019  Intel Corporation today announced that its board of directors has named Robert (Bob) Swan as chief executive officer.

Waterproof graphene electronic circuits

01/31/2019  Water molecules distort the electrical resistance of graphene, but a team of European researchers has discovered that when this two-dimensional material is integrated with the metal of a circuit, contact resistance is not impaired by humidity. This finding will help to develop new sensors -the interface between circuits and the real world- with a significant cost reduction.

VIS to acquire GLOBALFOUNDRIES' Fab 3E in Singapore

01/31/2019  Vanguard International Semiconductor Corporation (VIS) and GLOBALFOUNDRIES (GF) today announced that VIS will acquire GF's Fab 3E in Tampines, Singapore.

Helix Semiconductors adds new board member

01/30/2019  Fabless power semiconductor company Helix Semiconductors today announced that Rudi De Winter has joined its board of directors.

Micron EOL 8G DDR3L SDRAMs now available direct From Alliance Memory

01/25/2019  Alliance Memory today announced that it is offering several end-of-life 8G DDR3L SDRAMs for which Micron Technology Inc.

North American semiconductor equipment industry posts December 2018 billings

01/25/2019  December billings of North American equipment manufacturers ended 2018 on a positive note.

Semiconductor unit shipments exceeded 1 trillion devices in 2018

01/24/2019  Semiconductor units forecast to increase 7% in 2019 with IC units rising 8%, O-S-D units growing 7%.

Nikon, ASML and Carl Zeiss sign agreement to settle all litigation

01/23/2019  Nikon Corporation, ASML Holding N.V., and Carl Zeiss SMT GmbH have signed a Memorandum of Understanding relating to a comprehensive settlement of all legal proceedings over patents for lithography equipment and digital cameras.

SEMICON Korea highlights smart tech, industry growth and workforce development

01/22/2019  SEMICON Korea 2019 opens tomorrow with electronics industry growth drivers artificial intelligence (AI), Smart manufacturing, and MEMS and sensors in the spotlight.

A year of transformation and execution: Focus on creating member value

01/22/2019  Last year the industry posted another remarkable double-digit revenue growth year. IC shipments eclipsed one trillion units for the first time and continued to enable an ever-expanding array of silicon intensive-applications.

Soitec expands collaboration with Samsung Foundry on FD-SOI wafer supply

01/22/2019  Soitec (Euronext Paris), a designer and manufacturer of innovative semiconductor materials, announced today an expanded collaboration with Samsung Foundry to ensure the volume supply of fully depleted silicon-on-insulator (FD-SOI) wafers.

Global GDP growth increasingly important driver of IC market growth

01/22/2019  IC Insights is in the process of completing its forecast and analysis of the IC industry and will present its new findings in The McClean Report 2019, which will be published later this month.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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