By Dr. Phil Garrou, Contributing Editor
Yes, we have now passed numero 200 on what I shall self proclaim the #1 informational blog for 3DIC and advanced packaging on the internet! Again, my thanks to Pete Singer for continued support.
Now that you have taken a look at us, let’s take a look at some of the presentations at this year’s ConFab. Subramani Kengeri, Vice President, Advanced Technology Architecture for GlobalFoundries discussed the techno-economics of the semiconductor industry.
Emerging applications will include:
1. Computer vision
2. Augmented reality
3. Concurrent application and modem operation
4. Gesture recognition
5. Medical applications
6. Contextual awareness
7. HD video and games
8. 3D camera and 3D display
9. Multiple concurrent displays
10. Multiple concurrent audio and video CODECS
Kengeri concludes that “the semiconductor industry is challenged on the Economics of technology scaling.” Cost of building a new leading edge fab continues to escalate while capex / wafer is increasing at a rate of 38%.
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In addition, ROI is delayed due to increased investment requirements and longer time to volume.
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GF also offered some interesting insights into the industry landscape.
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Gary Patton, VP of IBM Semiconductor Research & Development Center addressed “Semiconductor Technology: Trends, Challenges, & Opportunities.” Patton confirmed that scaling beyond 22nm will require alternative device structures and new material innovations.
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Beyond silicon, packaging and board innovations are required to continue to miniaturize. IBM points to interposers and die stacking to do this.
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Adrian Maynes, 450C program manager, discussed the “450mm Transition Toward Sustainability: Facility & Infrastructure Requirements.”
G450C is a public/private program based at the College of Nanoscale Science & Engineering in Albany with goals of :
– Driving effective industry 450mm development
– Focus on process & equipment development
Members include Intel and the major foundry players and for now IBM (rumors of their acquisition by GF remain rampant).
The consortium sees the following changes coming between 300mm and 450mm.
For all the latest on 3DIC and advanced packaging, stay linked to IFTLE…
