By Dr. Phil Garrou, Contributing Editor
Continuing our look at advanced packaging activity at the 2016 SEMICON Taiwan. This week let’s look at some presentations that focused on TSV based packaging.
SPIL – TSV in IC Packaging
Mike MA of SPIL reviewed the status of TSV in IC Packaging. His summary of current TSV usage is shown below:
- TSV in CIS – Sony
- TSV in MEMS/Sensor
- 3D IC with TSV – only in High Band Width (HBM) DRAM
-Hynix, Samsung start HBM-1 LVM in 2015
-HBM-2 in 2016
– Advantage proven, cost still high
- 2.5D IC with TSV Si Interposer
– 2010 Xilinx debuted 1st product group (FPGA)
– 2015: AMD rolled out 2nd product group (GPU+HBM)
– 2016 nVidia GP100 with HBM-2
– Renewed interest for high end networking, VR/AR
SPIL currently doing 40um pitch on their ubumps as shown below.
SPIL is a proponent of the so called “chip on wafer last” process flow as shown below:
Other interesting comments by Ma include:
“The glass interposer has come and gone due to a lack of ecosystem”
“Fine line organic interposers keep delaying delivery of 5um L/S with still unknown costs. PCB insustry needs to invest in sub 5um L/S”
“Fan out packaging is capable of 2um L/S x 2 layers, but larger package size (> 15 x 15mm sq) will be challenging”
Amkor – Large Die Assembly with TSV Packaging
JY Khim discussed large die assembly technology in TSV packages. He notes the following points about their multi-die platforms:
CoS Process Flow
- No molding • Interim test available
- Mold sensitive components OK • Shared infrastructure with FCBGA
Initial interposer warpage affects the PCB + interposer warpage. For the successful top die attach warpage minimization of interpose is important. Tuning the Inorganic C4-side passivation layer can reduce interposer warpage.
He compares the CoS to the CoW process below:
In the CoW Process, there are no warpage risks in top die attach on interposer regardless of die size.
Khim showed the following table containing Amkor 2.5D CoW experience.
EVG – Chip Stacking in High Volume
For those looking for a good comparison of Samsung vs Hynix stacked memory cross sections, Wimplinger of EVG offered us the following figure and table comparing the two.
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