By Dr. Phil Garrou, Contributing Editor
SEMICON Taiwan
Although threatened by Typhoon Talim, SEMICON Taiwan went forward Sept 13-15 in Taipei. Over the next few weeks IFTLE will be covering Interesting advanced packaging disclosures and topics with relevance to advanced packaging. Our thanks to Semi’s Debra Geiger, Jamie Liao and Grace Wang for linking IFTLE to the relevant materials.
CP Hung of ASE chaired the SiP forum “3D IC, 3D interconnection for AI & High-End Computing” and Albert Lan of Applied Materials chaired the forum “Innovative “Embedded Substrate” and “Fan-Out” Technology to Enable 3D-SiP Devices.”
Albert Lan – Applied Materials
CP Hung – ASE
Let’s first take a look at the embedded and fan-out forum
TechSearch
Jan Vardaman presented the following list of Fan-out WLP suppliers
TechSearch lists the following as why Apple chose this TSMC packaging format for their A10 processor
- Improved electrical and thermal performance of InFO vs. FC-‐CSP
– InFO PoP Power Noise Reduction and Signal Integrity Improvement
- Thinner than flip chip package (no substrate)
– InFO-‐PoP is 20% thinner than FC-‐PoP
– Can enable a low-‐profile PoP solution as large as 15x15mm
An interesting comparison of Amkor’s SWIFT vs ASE’s FOCoS vs TSMC’s InFO.
Lastly, the TechSearch list of fan-out WLP evolving applications:
- Baseband processors
- Application processors
- RF transceivers, switches, etc.
- Power management integrated circuits (PMIC)
- ConnecDvity modules
- Radar modules (77GHz) for automotive plus other ADAS applications
- Audio CODECs
- Microcontrollers
- Logic + memory for data centers and cloud servers
- Power devices
- Fingerprint sensors
Yole Developpement
Jérôme Azémar of Yole gave their take on “Fan-Out Packaging Technologies and Markets”.
Long time IFTLE readers know that we dislike the term fan out since all packages except fan-in WLP are fan out packages. To add to this Yole has added the following:
Their take on applications is show below plotting package size vs IO count.
Yole sees significant future growth initiated by the Apple adoption of the TSMC InFO package.
For all the latest on advanced packaging, stay linked to IFTLE…
