Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES



Plasma-Therm completes acquisition of France-based CORIAL

06/13/2018  Plasma-Therm, the manufacturer of plasma etch, deposition, and advanced packaging equipment for the production of specialty semiconductor devices, announced today the successful acquisition of CORIAL, a France-based plasma processing equipment supplier.

IEEE Electronics Packaging Society honors heterogeneous integration pioneer and other innovators

06/05/2018  IEEE, the world's largest technical professional organization dedicated to advancing technology for humanity, and the IEEE Electronics Packaging Society (EPS) today announced Dr. William Chen as the recipient of the 2018 IEEE Electronics Packaging Award.

The advanced packaging industry is on the move

05/30/2018  Without any doubt, the advanced packaging industry is on the move. Emerging applications are bringing many new challenges. Packaging experts from all over the world are deeply involved in the development of innovative solutions to answer to the market demand dominated by megatrends.

Global substrate-like PCB market: Need for miniaturization drives growth

05/25/2018  The global substrate-like PCB market will grow at a CAGR of over 7% during the forecast period, according to Technavio analysts.

Cohu to acquire Xcerra

05/08/2018  Cohu, Inc. and Xcerra Corporation today announced they have entered into a definitive merger agreement pursuant to which Cohu will acquire Xcerra for a combination of cash and stock.

Turning graphene into light nanosensors

04/26/2018  Tuning the graphene embedded in a photonic crystal by varying the external temperature can transform it into a light-sensitive sensor.

Orbotech's SPTS Technologies honored with Queen's Award for Enterprise in Innovation 2018

04/24/2018  The award recognizes SPTS's development of novel physical vapor deposition (PVD) process solutions for Fan-Out Wafer Level Packaging (FOWLP) of semiconductor devices.

Semiconductor assembly and packaging services: Rising number of fabs is driving the market

04/23/2018  Technavio market research analysts forecast the global semiconductor assembly and packaging services market to grow at a CAGR of close to 5% during the period 2018-2022, according to their latest report.

SEMI and TechSearch International report global semiconductor packaging materials market reaches $16.7B

04/18/2018  SEMI, the industry association representing the global electronics manufacturing supply chain, and TechSearch International today reported that the global semiconductor packaging materials market reached $16.7 billion in 2017.

Amkor factories receive key automotive certification

04/16/2018  Amkor Technology, Inc. today announced that multiple factories have passed certification audits for IATF 16949:2016, a key certification required for manufacturers who supply products to the automotive market

China now world's largest consumer of semiconductor packaging equipment and materials

04/02/2018  Fueled by heavy government investment, IC packaging and testing in China generated $29 billion in revenue in 2017, making China the world's largest consumer of packaging equipment and materials.

A treasure trove for nanotechnology experts

03/06/2018  A team from EPFL and NCCR Marvel has identified more than 1,000 materials with a particularly interesting 2D structure. Their research paves the way for groundbreaking technological applications.

Work to do to keep the good times rolling

03/02/2018  2017 was a terrific year for SEMI members. Chip revenues closed at nearly $440B, an impressive 22 percent year- over-year growth.

SEMI showcases achievements in flexible hybrid electronics, MEMS and sensors at 2018FLEX and MSTC conferences

02/22/2018  Technology trail-blazers explore business insights, new technologies, integration strategies at co-located events, held February 12-15, 2018 in Monterey, CA.

Siemens continues to invest in IC industry with planned acquisition of Sarokal Test Systems

02/15/2018  Siemens announced it has entered into an agreement to acquire Oulu, Finland-based Sarokal Test Systems Oy.

Lam Research and Tokyo Electron gained in full year 2017 semiconductor equipment market shares

02/06/2018  Market shares of top semiconductor equipment manufacturers for the full year 2017 indicate large gains by Tokyo Electron and Lam Research while top supplier Applied Materials dropped.

Boston Semi Equipment develops custom automation modules for strip handling equipment

01/31/2018  Boston Semi Equipment (BSE) today announced that it has started shipping units of its new strip load/unload module to a top 10 semiconductor manufacturer.

Alpha and Omega Semiconductor announces the newest generation of XSPairFET

01/30/2018  Alpha and Omega Semiconductor Limited (AOS) (Nasdaq:AOSL), a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today introduced AONE36132, a 25V N-Channel MOSFET in a dual DFN 3.3x3.3 package which is ideal for synchronous buck converters.

GLOBALFOUNDRIES delivering 45nm RF SOI customer prototypes for 5G applications

01/26/2018  Company's advanced 300mm RF SOI offering is ready for volume production.

Turbulent times ahead for trade

01/25/2018  International trade is one of the best tools to spur growth and create high-skill and high-paying jobs. Over 40 million American jobs rely on trade, and this is particularly true in the semiconductor supply chain. Over the past three decades, the semiconductor industry has averaged nearly double-digit growth rates in revenue and, by 2030, the semiconductor supply chain is forecast to reach $1 trillion.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts