Materials

MATERIALS ARTICLES



EUVL: Taking it down to 5nm

05/17/2016  The semiconductor industry is nothing if not persistent — it’s been working away at developing extreme ultraviolet lithography (EUVL) for many years.

This 'nanocavity' may improve ultrathin solar panels, video cameras and more

05/13/2016  The future of movies and manufacturing may be in 3-D, but electronics and photonics are going 2-D; specifically, two-dimensional semiconducting materials.

Monolithic Schottky diode in ST F7 LV MOSFET technology: Performance improvement in application

05/11/2016  Standard solutions and devices are compared to a 60 V MOSFET with monolithic Schottky diode as evaluated in SMPS and motor control environments.

Novel functionalized nanomaterials for CO2 capture

05/10/2016  Climate change due to excessive CO2 levels is one of the most serious problems mankind has ever faced. CO2 emissions need to be reduced urgently to avoid potentially dangerous and irreversible effects of climate change. To mitigate such emissions, CO2 capture is one of the best solutions. Scientists at the Tata Institute of Fundamental Research, Mumbai, have developed novel functionalized nanomaterials that can capture CO2 with superior capture capacity and stability over conventional sorbents.

Researchers integrate diamond/boron nitride crystalline layers for high-power devices

05/10/2016  Materials researchers at North Carolina State University have developed a new technique to deposit diamond on the surface of cubic boron nitride (c-BN), integrating the two materials into a single crystalline structure.

Global semiconductor sales increase slightly in March

05/06/2016  The Semiconductor Industry Association (SIA) this week announced worldwide sales of semiconductors reached $26.1 billion for the month of March 2016, a slight increase of 0.3 percent compared to the previous month's total of $26.0 billion.

Molybdenum disulfide holds promise for light absorption

05/05/2016  Rice University researchers probe light-capturing properties of atomically thin MoS2.

Dow's Peter Trefonas, Ph.D, to receive prestigious Perkin Medal

05/05/2016  The Society of Chemical Industry (SCI), America Group, announced today that Peter Trefonas, Ph.D., corporate fellow in Electronic Materials at The Dow Chemical Company, has won the 2016 SCI Perkin Medal.

Exploring phosphorene, a promising new material

05/03/2016  Researchers have developed a new method to quickly and accurately determine the orientation of phosphorene, a promising material with potential application as a material for semiconducting transistors in ever faster and more powerful computers.

University of Illinois researchers create 1-step graphene patterning method

04/28/2016  Researchers from the University of Illinois at Urbana-Champaign have developed a one-step, facile method to pattern graphene by using stencil mask and oxygen plasma reactive-ion etching, and subsequent polymer-free direct transfer to flexible substrates.

Rare Earth atoms see the light

04/25/2016  Physicist Dirk Bouwmeester discovers a promising route for combined optical and solid state-based quantum information processing.

Indium Corporation announces Andreas Karch as Regional Technical Manager

04/25/2016  Indium Corporation has hired Andreas Karch as Regional Technical Manager, Germany, Austria and Switzerland.

Researchers develop new semiconducting polymer for forthcoming flexible electronics

04/20/2016  A joint research team has developed a new n-type semiconducting polymer with superior electron mobility and oxidative stability.

'Odd couple' monolayer semiconductors align to advance optoelectronics

04/15/2016  In a study led by the Department of Energy's Oak Ridge National Laboratory, scientists synthesized a stack of atomically thin monolayers of two lattice-mismatched semiconductors.

Packaging materials: Strong growth rates for small form factors

04/13/2016  While much of the recent attention has been focused on the growth of wafer level packages (WLPs), specifically fan-out WLPs, this is not the only segment forecast to undergo strong unit growth.

Quantum dots enhance light-to-current conversion in layered semiconductors

04/08/2016  Harnessing the power of the sun and creating light-harvesting or light-sensing devices requires a material that both absorbs light efficiently and converts the energy to highly mobile electrical current.

TowerJazz announces its SiGe Terabit Platform

04/05/2016  TowerJazz, the global specialty foundry, today announced its SiGe Terabit Platform targeting high-speed wireline communications for the terabit age.

IEEE Photonics Society's Issues Call for Papers for 13th International Group IV Photonics Conference

04/04/2016  The 2016 International Group IV Photonics Conference, sponsored by the IEEE Photonics Society, has announced the Call for Papers seeking original research on the Novel Materials & Nanophotonics; Photonic Devices; and Silicon Photonics Applications & Systems.

Chipmakers seek solution to neon gas supply shortage

03/30/2016  Finding a short term solution to the neon gas shortage problem will be challenging.

How finFETs ended the service contract of silicide process

03/25/2016  A look into how the silicide process has evolved over the years, trying to cope with the progress in scaling technology and why it could no longer be of service to finFET devices.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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