CEA-Leti (Grenoble, France) has opened a complete 300 mm fab extension dedicated to 3D integration applications. Final equipment installations will continue through to the end of this year with an inauguration event planned in January.
The integration line includes lithography, metallization, deep etching, dielectric deposition, wet etching and packaging tools that will be available for Leti’s customers and partners around the world. The line will complement Leti’s 3D integration toolbox, which includes through-silicon vias (TSVs), alignment, bonding, grinding, thinning, planarization, bumping, micro-inserts and design capabilities, and mixed-signal IC applications.
The new line will expand Leti’s 3D capabilities, and will allow the research center to offer heterogeneous integration technologies to customers on 200 and 300 mm wafers.