CEA-Leti Announces Improvements
MEMS-based technology continues to be highlighted at this year’s SEMICON West show. Today, CEA-Leti announced that its RF MEMS switch technology has been significantly improved. The new switch design is based on a dielectric-less solution in which an air gap is used to prevent switch contact. Small dielectric dots placed under the mobile electrode provide the necessary air gap. Long-term tests show a drastic improvement in reliability with no pull-down voltage drift. The new switch-manufacturing process has been demonstrated on 200mm silicon wafers on the MINATEC-dedicated MEMS fabrication platform.
For more information, visit www.leti.fr