The journey to 300mm wafers continues. SEMI Europe will host a workshop titled “Beyond 300mm: Packaging Challenges and Opportunities for 450mm Wafers and Panel Scale Solutions” on April 24 in Grenoble, France. This workshop will offer perspectives and answers to the complex wafer-size transition issue facing the semiconductor industry. The workshop covers the core topics of packaging of 450mm wafers and panel scale solutions.
Much of the discussion will include a front-end view of a 450mm wafer introduction that will create new challenges for assembly and packaging. Key issues include: What new challenges will emerge related to the packaging of 450mm wafers? Do today’s back-end players already address the issues? Are disruptive technologies expected? Are there opportunities for new entrants? What is the situation in terms of standards? The workshop will be one of the most complete public discussions to date addressing these open questions. Executives from Entegris, CNSE Albany, and SOITEC will deliver presentations, and a panel discussion with representatives of EVG, SET, RECIF Technologies, and CEA-LETI will allow attendees to interact with experts on the domain.
The second part of the workshop involves selecting panel scale packages. As a normal evolution of packaging to help in reducing cost, speakers will give their thoughts and share latest results on large-scale packages. Issues include: What is the situation today in terms of development and maturity? Can large size packages be fabricated with high throughput and good yields? Speakers in this session will talk about technologies such as fan-out wafer-level packages on rectangular rebuilt wafers, embedded die in laminate, glass carrier with and without vertical vias enabling 2.5D integration. Executives from YOLE, ASE, STATS ChipPAC, and AT&S will present their views.
The workshop is targeting senior-level technologists, managers, and executives from leading companies and organizations around the world. Attendees will get an excellent summary and overview of the industry situation on Packaging-related items of 450mm wafer and panel scale solution. Registration will open in early March. For more information, visit www.semi.org/beyond300mm.