FleX Silicon-on-Polymer IC (Source: American Semiconductor)How will the industry confront the challenges to move printed/flexible electronics into real markets? With the market for printed and flexible electronics projected around $176 million this year but targeted for 27% CAGR to about $950 million by 2020, SEMICON West is helping the industry begin to mobilize and respond to the challenges.
Developers have made major progress in the technology to manufacture printed or flexible circuits, sensors, batteries and displays. But it’s hard to build applications with much market pull without logic or memory as well, and those have been much harder to make. However, now printed memory and solutions for integrating conventional silicon die into flexible systems are edging into production to potentially improve performance for a wider range of applications. On the display side, easily integrated printed or flexible transparent conductive films for touch screens are starting to see some market traction.
Attend “Integrating Conventional Silicon in Flexible Electronics” at the Extreme Electronics TechXPOT, Moscone Center, South Hall (Thursday, July 11 from 10:30am-1:10pm). The FlexTech Alliance program includes:
– Douglas R. Hackler, American Semiconductor, on “FleX™ Silicon-on-Polymer: Flexible Electronics from Conventional Silicon ICs”
– Quyen Chu, Jabil, on “Investigation of Components Attachment onto Low Temperature Flex Circuit”
– Dahwey Chu, Sandia National Laboratories, on “Electronic in the Prototyping of Flex Systems”
– Yung-Yu Hsu, MC10, on “Reshaping Electronics for the Human Body”
– Chandrasekhar Durisety, Thin Film Electronics on “Introduction to Thinfilm Technology”