Wafer Processing and More at SEMICON West 2012
The semiconductor industry has shifted and changed over the years, but SEMICON West remains a bellwether of new technology developments for semiconductor design and manufacturing. Technologists, executives, journalists, and other industry experts return to San Francisco each summer to connect with the latest technologies and trends driving Moore’s Law and enabling next-generation microelectronics.
Another semiconductor industry constant is the need for human connections. SEMICON West enables the face-to-face interactions that attendees use to renew friendships, make new contacts, and discuss new ideas and best-practices techniques. There are plenty of activities and events around the exhibition that support the sharing and the synergy that can lead to innovation and opportunity.
SEMICON West 2012, which opens its doors July 10-12 at San Francisco’s Moscone Center, offers visitors the opportunity to engage with technology companies, see new products, and gain insights into the technologies moving microelectronics manufacturing.
Technology Trends on the Show Floor: Exploring the TechXPOTs at SEMICON West
Since their debut in 2006, TechXPOT (“tech spot”) stages have become a familiar fixture on the SEMICON West show floor. Each of the three TechXPOT stages offers visitors a full schedule of free technical sessions and “mini conferences” addressing critical microelectronics manufacturing topics and challenges.
TechXPOT North (located in North Hall), is primarily dedicated to sessions addressing packaging, test, and other final manufacturing issues.
Tuesday, July 10
Contemporary Packaging: Achieving Cost Advantage Through Innovation
Hosted by the Advanced Packaging Committee, SEMI Americas
10:30am-12:30pm
Semiconductor Test: Adding Value through Yield and Better Data Management
1:30pm-4:00pm
Wednesday, July 11
Highlights of International Test Conference
10:30am-12:30pm
The 2.5 & 3D Packaging Landscape for 2015 & Beyond
Hosted by the Advanced Packaging Committee, SEMI Americas
1:00pm-3:30pm
Thursday, July 12
Hosted by the Advanced Packaging Committee, SEMI Americas
10:30am-12:30pm
ITRS Back End of Line Technologies
1:00pm-3:30pm
The TechXPOT South (South Hall) schedule covers front end manufacturing equipment, materials, and process topics and some of the industry’s most critically anticipated technology developments including the 450mm wafer transition and EUV lithography.
Tuesday, July 10
Enabling Sub-22nm with New Materials and Processes
10:30am-12:30pm
A Look to the Next Generation of Electronic Materials
Hosted by the Chemical & Gases Manufacturer Group (CGMG) of SEMI
1:30pm-3:30pm
Wednesday, July 11
Lithography: Extending Double-patterning, Industrializing EUV and Complementary Technologies
10:30am-12:50pm
Secondary Market Challenges and Future
1:30pm-3:30pm
Thursday, July 12
SEMICON West 450mm Supply Chain Forum
10:30am-12:00pm
ITRS Front End of Line Technologies
1:00pm-3:30pm
The Extreme Electronics TechXPOT (located in South Hall) is the place to discover trends and opportunities in emerging and adjacent technology markets including LEDs, MEMS, and plastic electronics.
Tuesday, July 10
Taking MEMS to the Next Level: Transitioning to a Profitable High Volume Business
Morning session: 10:30am-12:30pm
Afternoon session: 1:30pm-3:30pm
Wednesday, July 11
Enabling the Next generation of HB LEDs
Morning session: 10:30am-12:30pm
Afternoon session: 1:30pm-3:30pm
Thursday, July 12
10:30am-1:00pm
2:00pm-3:30pm