US mediates in EU-China solar trade spat

US Solar Energy Industries Association (SEIA) has expressed its support for US government’s role as mediator in negotiations between the European Union and China to resolve anti-dumping case against Chinese manufacturers.

The US is rumoured to have brought to the negotiating table an offer to suspend its own duties on Chinese exports whilst setting a quota on Chinese exports and a minimum price for solar products, according to Bloomberg.

Carol Guthrie, US trade representative told PV-Tech: “Our goal is to support a healthy global solar industry in conditions that foster the adoption of renewable energy and continued innovation and a level playing field for all. Toward those ends, we will continue to work with industry and our trading partners to explore ways to resolve concerns.”   

Guthrie confirmed: “Active negotiations have not yet begun.”

Photo Credit: PV TechMichael Froman, a White House adviser and President Barack Obama’s nominee to head the US trade office, informed senators that the US is exploring talks with China and the EU, according to Bloomberg.

The US is looking to avoid giving Chinese producers a way to bypass paying taxes to the US by sending partially assembled solar equipment to the US and exporting to the EU thereby avoiding paying not only European but also US duties. 

However a spokesman for module manufacturer Trina Solar told PV-Tech that products from the US would “not offer the same benefit of cost rationalisations and economies of scale compared to Chinese producers. Also, these producers are increasingly attracted by growing demand in their neighbouring markets that is significantly stronger than in the EU.”

Importers of Chinese cells into the US have already been accused by the Coalition for American Solar Manufacturing, complainants in the US Department of Commerce’s case against Chinese manufacturers, of evading duties due to a loophole present in the US trade law which does not exist in EU law. READ MORE 

Touchstone Semiconductor Introduces The Industry’s Only Ultra Low-Power, Load Independent, High-Efficiency Boost

Photo Credit: Semiconductor OnlineMilpitas, CA (PRWEB) – Touchstone Semiconductor, a leading developer of high-performance, low-power analog integrated circuit solutions, today announced the TS3300 boost regulator. The TS3300 uses only 3.5µA of supply current, and the TS3300’s efficiency performance is constant over a 100:1 span in output current. No other low power boost converter offers this level of performance.

The TS3300 is the industry’s first boost plus linear regulator that can operate from supply voltages as low as 0.6V up to 4.5V and can deliver at least 75mA of continuous output current. The TS3300 is ideally suited to be powered from a wide variety of power sources including single or multiple-cell alkaline or single Li-chemistry batteries. The boost regulator’s output voltage range can be user-set from 1.8V to 5.25V to power an entire range of low-power analog circuits, microcontrollers, and low-energy Bluetooth™ radios simultaneously. While configured to produce a 3V output from a 1.2V input source, the TS3300’s efficiency performance is constant over a 100:1 span in output current – no other low-power boost converter offers this level of performance. For powering low-energy radios, its internal, low-dropout linear regulator can deliver up to 100mA output current while reducing boost-converter-generated output voltage ripple by 3X. READ MORE

Mentor Graphics Pyxis Platform and PDK Automation Process Adopted by MagnaChip Semiconductor

Mentor Graphics Corp. (NASDAQ: MENT), a leader in electronic design automation, today announced that MagnaChip Semiconductor Corporation (“MagnaChip”) has adopted the Pyxis(R) custom IC design platform and the Mentor(R) process design kit (PDK) automation process. MagnaChip is a leading designer and manufacturer of analog and mixed-signal semiconductor products for high-volume consumer applications.

With significant growth in the customer base, MagnaChip added the Mentor Graphics(R) analog mixed-signal (AMS) design and verification solution that could handle a high level of mixed-signal complexity, different levels of design abstraction, and support multiple CAD tools in an integrated, unified environment. A key desired attribute was a reliable process for automating the creation of PDKs that could be easily inserted into their AMS design and verification flow.

“Pyxis expands our ability to work with multiple vendor tools with a proven process for automating the creation of PDKs, which is very important to our customers. With Mentor tools and their automated PDK creation process, MagnaChip is better positioned to serve broader customer base and expand businesses for both MagnaChip and Mentor Graphics,” said Taejong Lee, EVP and General Manager of MagnaChip’s Corporate Engineering Division.

The basic design components for analog mixed-signal IC design are delivered in the form of PDKs. Key components of the PDK are the fundamental building blocks for designing custom circuitry: transistors, resistors, capacitors, diodes, inductors, etc. PDKs have various models to represent these devices; functional verification models for use in simulation, symbols for use in schematics, parameterized and fixed geometries for use in layout and physical rules for use in physical verification.

“MagnaChip is a key partner of the deep submicron division of Mentor and one whose products have a growing importance in the marketplace,” said Robert Hum, vice president and general manager, DSM division, Mentor. “We are delighted that they have chosen the Pyxis custom IC design platform and our automated PDK tools and flow.”

About Pyxis

The Pyxis custom IC platform includes integrated solutions for design capture, floorplanning, custom routing, polygon editing, physical layout, schematic-driven layout, concurrent editing and chip assembly. To help companies jump-start their design cycles and cut time-to-market, Mentor and its foundry partners have developed design kits. These kits include all the foundry-specific devices and models for use with the Pyxis custom IC design and platform. The platform supports all common commercial design kit formats plus numerous customer proprietary formats. Mentor supports OpenPDK, iPDK and other industry standards.  READ MORE

Compact 800-W Programmable Power Supply Features Digital Controls

TDK Corp. has announced the expansion of TDK-Lambda’s Z+ Series of programmable power supplies, which now includes the new 800-W models in addition to the previously released 200- and 400-W models. These high-density, high efficiency, 2U format, bench-top and rack-mountable power supplies are designed to meet the demands of a variety of ATE, laboratory, and OEM applications, including test and measurement, semiconductor burn-in, component test, and LED/laser test. They also serve RF-amplifier, electromagnetic, and electrochemical applications.

TDK-Lambda’s new Z+800 provide 800 W of output power with a selection of output voltage ranges that cover from 0 to 100 VDC with output currents up to 72 A. The Z+ 800-W units are 66% smaller and 67% lighter than previous generations and provide a 200% increase in power density. All Z+ standard models are 3.27” high by 2.76” wide, so up to six units can be installed in the optional 19” rack housing; blanking plates are available for unused slots.

The Z+ 200-W, 400-W, 600-W, and 800-W programmable power supplies have comprehensive front panel controls with individual rotary encoders for output current and voltage. The controls also let users access power-supply settings such as OVP level, start-up mode, and remote control and monitoring of parameters. Separate 4-digit voltage and current displays are provided along with function/status LEDs, pushbuttons for output preview, output on/off, fine/coarse adjustment, and other features. Options for front panel output-jacks and multiple-unit housings are available for bench-top applications.

All Z+ models include built-in arbitrary waveform generation and storage for up to four preprogrammed functions; making them suitable for test and simulation tasks in the automotive, solar-panel and LED/laser industries, to name a few. These power supplies feature fast command processing times, output sequencing, and two programmable output pins that, for example, can be used to control isolation relays. Up to 12 voltage or current values can be programmed using the waveform creator software provided, and four waveforms can be stored in the Z+ unit’s memory. More complex waveforms can be created using NI LabVIEW. These waveforms can be either repetitive or single-shot and injected into the system under test. The results can be analyzed confirming the proper or faulty operation of the powered device or system. READ MORE

Spectro-X Simultaneously Analyzes Four RF and Microwave Spectrum Capture Files

X-COM Systems LLC, a subsidiary of Bird Technologies Group, has introduced Version 4.0 of its Spectro-X RF and microwave signal-analysis software—a comprehensive toolkit designed to search for and analyze signals of interest within long-duration recordings of signal activity. The new version can simultaneously analyze up to four recorded RF and microwave spectrum files with precision file alignment to plus or minus one sample. It includes multidomain correlated markers and features that make the software more versatile and easier to use.

There are many applications for Spectro-X software, including development and analysis of ELINT, SIGINT, ECM, ESM, multichannel communications, and MIMO system performance. The software can also be used for testing radar systems. The software requires no programming skills and can reduce the time required to discover RF anomalies within a complex spectral environment or to evaluate signal characteristics over time.

Spectro-X operates on files of signal activity captured over the air using a COTS signal analyzer and X-COM’s new IQC5000A Series Spectrum Capture and Playback System or on custom spectrum files created in The Mathworks’ MATLAB or other software. It has four discrete search engines (carrier, wireless standard, arbitrary waveform, and pulse) that allow users to zoom in to specific sections of a file in frequency, time, or both, to find signals of interest. Results can be exported in a file format usable by vector signal analysis software for demodulation and detailed analysis. Pulsed waveforms can be characterized by their rise and fall times, pulse width, pulse repetition interval, peak and average power, and carrier frequency.

Multichannel Capabilities

Spectro-X 4.0 now allows up to four different files recorded at different times to be aligned in time in order to make comparisons between them. For example, in a typical “threat and response” scenario on a test range, an aircraft might make four passes through the measurement area, perform the same RF or microwave functions, and be subjected to the same jamming or radar pulses each time. The operator must interpret the data from each pass to determine how the aircraft’s threat protection systems performed. In addition, Spectro-X makes it easier to identify different levels of interference that occurred during each pass. The four files can also be offset in time and compared, placing marker measurements on all four plots. This is helpful when evaluating the performance of a radar system for example, to see if it performs exactly the same way during each scan.  READ MORE

SEMI Announces Silicon Innovation Forum to Bridge Funding Gaps for Early-Stage Companies

SEMI, in collaboration with leading strategic investing groups throughout the global semiconductor industry, has announced the Silicon Innovation Forum (SIF) to bridge funding gaps for new and early-stage companies with valuable semiconductor manufacturing and technology solutions. SIF will be held in conjunction with SEMICON West, on July 9, 2013 at the Moscone Center in San Francisco, Calif. The event will consist of a one-half day conference highlighted by investment presentations from new and emerging companies with innovative technology solutions targeted at next-generation semiconductors. The Silicon Innovation Forum is being organized by leading strategic investment groups in the industry including Applied Ventures, Dow Chemical Company, Intel Capital, Micron Ventures, TEL Venture Capital, and Samsung Ventures.

Denny McGuirk Courtesy SEMI“At a time when the need for new ideas and technologies has never been greater, venture capital and private funding sources for advanced semiconductor technology development has significantly declined over the past decade, threatening the future of Moore’s Law and the economic engine of today’s connected electronic society,” said Denny McGuirk, president and CEO of SEMI. “The Silicon Innovation Forum will address these funding gaps by providing a platform for new and emerging innovators, strategic investors, and venture capitalists to discuss the needs and requirements for next-generation technologies, and provide insights into technology, capital, partnership, and collaboration strategies necessary for mutual success.”

This unprecedented collaboration of leading strategic investor groups from throughout the world has formed to streamline and accelerate partnership opportunities for technology entrepreneurs to bridge the gap between R&D and product development funding. The Forum will provide short-term business opportunities for early / mid-stage companies, R&D entrepreneurs from larger companies, and other industry innovators while addressing long-term structural changes to the industry necessary to foster a healthy innovation pipeline.

New and emerging companies can showcase their innovations through tabletop and/or poster displays for one-on-one meetings with qualified investors, and they can showcase their ideas in short pitches during the SiF Conference. The SIF Conference will be free to all SEMICON West attendees, but the Innovation Showcase and Reception for one-on-one presentation and meeting opportunities will be restricted to qualified partnership and investor groups.

For more information on the Silicon Innovation Forum and for information on how to participate visit: www.semiconwest.org/sif

 

Intel CEO to Retire as Chipmaker Struggles Through Mobile Transition

by Jeff Dorsch

Paul Otellini – courtesy IntelWhen Paul Otellini, the president and chief executive officer of Intel, retires next May, he will have served for eight years in the giant chipmaker’s top post. Intel has had five CEOs since it was founded in 1968. That means he will step down shy of the average nine-year tenure for an Intel CEO.

The announcement of his retirement comes as Intel is making the transition to the post-PC era of computing. Mobile devices, principally smartphones and tablet computers, are increasingly becoming the choice of consumers for accessing the Internet, checking e-mail, going on social networks, and playing games and videos. Corporate enterprises are recognizing the trend in adopting “bring your own device” (BYOD) policies for their employees. Desktop PCs are dirt cheap these days and laptop computers are scarcely more expensive than desktops.

The trend to mobile electronics has hit hard at Dell and Hewlett-Packard, the one-time champions of the PC industry. These former stalwarts have been been supplanted by Lenovo Group as the king of the hill in personal computers. Much of Lenovo’s recent strength is due to its home base – China – is the only global region still experiencing growth in PC sales.

Intel has seen the writing on the wall about refocusing on smartphones and tablets. The market verdict on whether it can achieve dominance in low-power mobile processors is still out; rival ARM Holdings is aggressively addressing that market while going upmarket with 64-bit processor designs that could go into high-performance servers and supercomputers, areas that have traditionally been strong for Intel’s Itanium and Xeon processors.

Advanced Micro Devices is going through its own struggle in shifting its focus from PCs to mobile devices, microservers, and other high-growth applications.

At this point, Otellini would be graded “incomplete” on whether he has successfully guided Intel into the burgeoning era of mobile electronics. The company’s Atom processors and other chips still may prove to be widely accepted in mobile designs. Maybe they will go into Apple’s iOS-based products. Maybe not.

Otellini’s greatest triumph, in the eyes of many observers, was persuading Big Blue to use Intel’s 8088 processors in the IBM Personal Computer, a decision that dealt a crushing blow to Motorola’s Semiconductor Products Sector (now Freescale Semiconductor), National Semiconductor, and Zilog. When the IBM PC was “cloned” by other computer manufacturers, they overwhelmingly chose Intel processors for their PC models, which helped Intel become the world’s largest chipmaker, measured by annual sales. That was, howver, over three decades ago.

Intel is likely to choose an internal candidate for its next CEO. Whoever that person is will inherit a substantial competitive challenge.

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by Jeff Dorsch

What can the technology industry expect in President Barack Obama’s second term? If American history is any guide, the answer won’t be “More of the same.”

Broadly speaking, second presidential terms have often proved to be troublesome for re-elected incumbents, especially in the past four decades. Since he doesn’t have to face another election in his political career, it is widely assumed that President Obama will go for making significant progress on burning political issues, such as the federal deficit and debt, immigration reform, and taxation.

There was a stark difference between President Obama and his Republican rival, former Governor Mitt Romney, on a variety of issues, including technology policy subjects and related topics.

 The Technology page of the White House website sets out a dozen “examples of progress” in the president’s first term, including the naming of the federal government’s first chief technology officer.

While tech policy didn’t get much attention in the 2012 campaign, there are five leading tech issues facing the Obama administration in the second term, Heather Kelly of CNN writes in an analysis. They include copyright piracy, cybersecurity, and privacy rights. The U.S. Senate has twice this year turned back consideration of cybersecurity legislation, with Republicans objecting to government oversight of computer networks run by private enterprises. In response to that rejection, the administration is expected to go ahead with an executive order mandating the protection of critical infrastructure in the U.S.

In addition to consumer privacy and infrastructure cybersecurity, the allocation of wireless spectrum is a leading topic. “This president has laid out a very aggressive mobile agenda and has begun to execute on it. I think the next four years are really going to be about execution, execution, execution,” said Bryan Tramont, a managing partner at Wilkinson, Barker and Knauer. Tramont once served as the chief of staff for Michael Powell when Powell was the chairman of the Federal Communications Commission.

“We have to do everything we can to encourage the entrepreneurial spirit, wherever we find it,” President Obama said in an address last year. “We should be helping American companies compete and sell their products all over the world. We should be making it easier and faster to turn new ideas into new jobs and new businesses. And we should knock down any barriers that stand in the way. Because if we’re going to create jobs now and in the future, we’re going to have to out-build and out-educate and out-innovate every other country on Earth.”

The next four years will determine whether the Obama administration can achieve those lofty goals.

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by Jeff Dorsch

The third generation of Intel desktop processors, marketed as the Core vPro Processors, is the latest type of microprocessors you’ll find in PCs. Their cousin for use in servers is the Xeon E3. All these processors are commonly known as “Ivy Bridge” processors, for their microarchitecture. “Ivy Bridge” is the successor to the “Sandy Bridge” architecture, which represented the second generation of Intel’s Core processors.

Long after processors have their formal launches and get their official brand names, they often retain their code names in media coverage and other references. “Sandy Bridge” was originally known as “Gesher,” the Hebrew word for bridge, but Intel dropped that code name when it learned that there once was an Israeli political party by that name.

Intel doesn’t want to attract controversy over its code names, as it did with Frank Zappa’s estate when it gave the “Zappa” code name to a chip project in 1995. For the most part, it has used geographic place names for its code names. There was a long string of processors named for rivers in California and Oregon – Clackamas, Deschutes, Klamath, Merced, Nehalem (a microchip architecture), Tillamook, Tualatin, Yamhill. North American place names represent a big portion of Intel’s code names now, including Bonnell (the first-generation Atom processor), for Mount Bonnell in Austin, Texas, where Intel has an IC design center. The code-name lexicon has gone worldwide, too, and there are a number of Hebrew words, thanks to Intel’s operations in Israel.

The successor to the “Ivy Bridge” and “Sandy Bridge” architectures is the “Haswell” architecture, which is apparently named for a town in Colorado. Chips with the “Haswell” architecture will be released in 2013.

Processor code names aren’t confined to Intel, of course. Advanced Micro Devices also names its chips and microarchitectures in development. The “Bulldozer” and “Piledriver” architectures are in its newest accelerated processing units, which combine CPUs with graphics processing units in one chip. AMD has resorted to international place names, such as Barcelona, Budapest, Geneva, Istanbul, Ontario, and Shanghai, for various processors. An island theme has emerged in recent years. The Radeon HD 6000 was code-named “Northern Islands,” the Radeon HD 7000 was “Southern Islands,” the forthcoming Radeon HD 8000 is code-named “Sea Islands,” and products set for 2014 and 2015 are reportedly code-named “Volcanic Islands” and “Pirate Islands.”

The electronics industry, as well, likes to employ code names for products in development. Google has famously named its releases of the Android mobile operating system after sweet treats, and done it in alphabetical order, no less. Starting with Android 1.5, they’ve had Cupcake, Donut, Éclair, Froyo, Gingerbread, Honeycomb, Ice Cream Sandwich, and Jelly Bean. While Apple retained “Lisa” as the official product name for an early desktop PC, the Apple III was code-named “Sara.” Microsoft Windows 95 was called “Chicago.” The IBM Enterprise Storage Server was “Shark.”

What’s your favorite industry code name?

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Microsoft, Nokia Bet Big on Windows Phone 8 to Battle Android, Apple in the Smartphone Market

By Jeff Dorsch

The introduction of Windows Phone 8 by Microsoft – wait a minute, let me close the window. There’s too much noise outside from people rushing to buy a new iPad.

There, that’s better. Okay, back to Windows Phone 8. The Microsoft mobile operating system was introduced a week ago, shortly after the formal launches of Windows 8 and Windows RT for computers. Like those operating systems, Windows Phone 8 features touch-screen capabilities that fit in well with smartphones in particular. (Tablet computers will generally employ Windows 8.) Nokia, once the mobile-phone champion of the world, tied up with Microsoft in early 2011 and made a big commitment to implementing Windows Phone (which was preceded by Windows Mobile) in its product line as an alternative to the open-source Symbian operating system that previously formed the OS basis of its phones. As a result, Nokia is on the Windows Phone 8 bandwagon, as are HTC, Samsung Electronics, and other leading phone purveyors.

The mobile electronics market is not evolving as the PC market did. The “Wintel” duopoly, which had Windows running on computers with Intel processors, is not what it once was and isn’t a strong contender in the smartphone market. Intel is getting its low-power Atom processors into some new smartphones and tablets, all of which run on Android, Google’s mobile operating system. Windows Phone is far, far, far behind Android and Apple’s iOS among mobile operating systems. The question now is whether Microsoft and Nokia can regain their leadership positions on the strength of Windows Phone 8.

It is too early for the market’s verdict, of course. Yet Microsoft clearly has ambitious plans for its mobile OS.  There’s an online Windows Phone Store to find the all-important apps for your Windows-based smartphone. And there are even reports that the company is looking at the prospect of developing a Microsoft-branded smartphone, now that it has delved deeper into the hardware market with its Surface tablet computer. (Its only previous hardware was the Xbox game console and its related Kinect motion sensor.) The software giant is looking toward hardware and services (such as its Windows Azure cloud-computing platform) to regain its growth mojo. Windows Office applications and the Windows OS business aren’t as big and profitable as they once were.

Could Microsoft regain the dominance it once enjoyed? Should it? Or is it time for other companies to take the industry spotlight? What do you think? Please leave a comment below.