Actions Semiconductor Co., Ltd. (Nasdaq: ACTS), one of China’s leading fabless semiconductor companies that provides comprehensive portable multimedia and mobile internet system-on-a-chip (SoC) solutions for portable consumer electronics, today reported its financial results for the first quarter ended March 31, 2012.

All financial results are reported on a U.S. GAAP basis.

Revenue for the first quarter of 2012 was $10.7 million, as compared to revenue of $12.3 million for the fourth quarter of 2011, and $9.4 million for the first quarter of 2011. 

Read More

Dr. Tzu-Yin Chiu, the CEO and Executive Director of Semiconductor Manufacturing International Corporation, presented the opening keynote at SEMICON China 2012. In a fortunate bit of timing, SMIC said that it has seen an increase in orders, and expects its capacity utilization rate for the first quarter to exceed earlier expectations. SMIC also expects further improvements in the second quarter of this year. This news follows on last week’s announcement from Taiwan Semiconductor Manufacturing Co. (TSMC) that it has raised its first quarter revenue forecast, citing increased orders from customers, especially from the mainland Chinese market.

Dr. Chiu‘s keynote address, “The Opportunities for China IC Industries,” explored China‘s rapidly growing semiconductor industry. Dr. Chiu noted several key growth areas in the growing Chinese economy, and he presented information on emerging opportunities in that market.

The annual SEMICON China show had over 16,000 visitors on its first day, surpassing expectations. In contrast to previous years, this show focused less on outright capital expenditures than on increasing productivity and profit through the current slowdown.

As an example, a presentation by Gang Zou, the general manager of Applied Materials Xi’an presented “Managing Through the Downturn,” in which he noted that today’s lower-than-expected fab utilization rates require extra attention on operational and production flexibility. He noted that in such environments, fab investment focuses more on tactical execution than on strategic positioning.

Also in contrast to previous SEMICON China events, enthusiasm in the secondary equipment market was significantly muted this year. Gary Robertson, general manager at KLA-Tencor’s KT Certified division, said that changes in the industry are evident in the secondary equipment market. An excess of used tools are available, and while some fabs – notably MEMS producers and specialty manufacturers – may benefit, overall the secondary market is facing oversupply.

While the SEMICON China 2012 show is widely seen as a success, the industry is working through a challenging time. When Gang Zou noted, “The road ahead will be bumpy, but the future will be bright,” he aptly summed up the overall mood of exhibitors and visitors alike.

SEMI: Industry Posts February 2012 Book-to-Bill Ratio of 1.01

According to SEMI, North America-based manufacturers of semiconductor equipment posted $1.33 billion in orders in February 2012 (three-month average basis) and a book-to-bill ratio of 1.01, according to the February Book-to-Bill Report published on March 22 by SEMI. That 1.01 book-to-bill ratio mean that $101 worth of orders were received for every $100 of product billed for the month.

The three-month average of worldwide bookings in February 2012 was $1.33 billion. The bookings figure is 12.2 percent more than the final January 2012 level of $1.19 billion, and is 16.5 percent below the $1.60 billion in orders posted in February 2011.

The three-month average of worldwide billings in February 2012 was $1.32 billion. The billings figure is 6.4 percent more than the final January 2012 level of $1.24 billion, and is 28.3 percent less than the February 2011 billings level of $1.84 billion.

“For the first time since September 2010, the book-to-bill ratio is over parity as three-month average bookings continued to increase,” said Denny McGuirk, president and CEO of SEMI. “Investments in advanced process technologies for NAND Flash, microprocessor, and foundry are key spending drivers for the year.”

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

Source: SEMI March 2012

The journey to 300mm wafers continues. SEMI Europe will host a workshop titled “Beyond 300mm:  Packaging Challenges and Opportunities for 450mm Wafers and Panel Scale Solutions” on April 24 in Grenoble, France. This workshop will offer perspectives and answers to the complex wafer-size transition issue facing the semiconductor industry. The workshop covers the core topics of packaging of 450mm wafers and panel scale solutions.

Much of the discussion will include a front-end view of a 450mm wafer introduction that will create new challenges for assembly and packaging. Key issues include: What new challenges will emerge related to the packaging of 450mm wafers? Do today’s back-end players already address the issues? Are disruptive technologies expected? Are there opportunities for new entrants? What is the situation in terms of standards? The workshop will be one of the most complete public discussions to date addressing these open questions. Executives from Entegris, CNSE Albany, and SOITEC will deliver presentations, and a panel discussion with representatives of EVG, SET, RECIF Technologies, and CEA-LETI will allow attendees to interact with experts on the domain.

The second part of the workshop involves selecting panel scale packages. As a normal evolution of packaging to help in reducing cost, speakers will give their thoughts and share latest results on large-scale packages. Issues include: What is the situation today in terms of development and maturity? Can large size packages be fabricated with high throughput and good yields? Speakers in this session will talk about technologies such as fan-out wafer-level packages on rectangular rebuilt wafers, embedded die in laminate, glass carrier with and without vertical vias enabling 2.5D integration. Executives from YOLE, ASE, STATS ChipPAC, and AT&S will present their views.

The workshop is targeting senior-level technologists, managers, and executives from leading companies and organizations around the world. Attendees will get an excellent summary and overview of the industry situation on Packaging-related items of 450mm wafer and panel scale solution. Registration will open in early March. For more information, visit www.semi.org/beyond300mm. 

Worldwide sales of semiconductor manufacturing equipment totaled $43.53 billion in 2011, a 9 percent increase over 2010 results, according to SEMI (San Jose, CA), the global industry association for manufacturing technology and materials suppliers to the semiconductor industry.

SEMI’s Worldwide SEMS Report reported increases for Europe, Japan, and North America. Both North America and Korea passed Taiwan on the spender’s list – North America with $9.26 billion in equipment sales, and Korea with $8.66 billion in sales. Former leader Taiwan settled into third place with $8.52 billion in equipment sales, a decrease of 24 percent from last year.

The SEMI report also shows that the worldwide wafer processing equipment market segment increased 15 percent while the assembly and packaging segment decreased 14 percent. Total test equipment sales decreased 9 percent. 

2010-2011 Semiconductor Capital Equipment Market by World Region

(Dollars are in U.S. billions; Percentage is Year-over-Year)

Source: SEMI/SEAJ March 2012

Note: Figures may not add due to rounding.