Mike Splinter of Applied Materials Receives 2013 SIA Robert N. Noyce Award

 Mike Splinter, chairman and chief executive officer of Applied Materials, has receiving the 2013 Robert N. Noyce Award, presented annually by the Semiconductor Industry Association, for outstanding achievement and leadership in support of the U.S. semiconductor industry.

The award is one of the industry’s highest honors and celebrates the memory of Robert Noyce, co-inventor of the integrated circuit and co-founder of Fairchild Semiconductor and Intel Corporation. The award will be presented at the annual SIA Award Dinner to be held on November 7, 2013.

With a portfolio of more than 10,000 patents, Applied Materials is a key equipment and technologies supplier that helps build the advanced microchips and displays essential to today’s top-selling electronic devices. Mike Splinter was named president and chief executive officer of Applied Materials in 2005 and chairman of the board of directors in 2009. Splinter is a 40-year veteran of the semiconductor industry and has led Applied Materials to record revenue and profits during his tenure.

Prior to joining Applied Materials, Splinter was an executive at Intel Corporation where he held a number of positions in his 20 years at the company, including executive vice president and director of Sales and Marketing and executive vice president and general manager of the Technology and Manufacturing Group.

Splinter began his career at Rockwell International in the firm’s Electronics Research Center. During his tenure, he became manager of the company’s Semiconductor Fabrication Operations and was awarded two patents. Author of numerous papers and articles, Splinter earned both Bachelor of Science and Master of Science degrees in electrical engineering from the University of Wisconsin, Madison.

 

BluGlass awarded $3m Australian Government clean tech innovation grant

As part of its Clean Technology Innovation Program, the Australian Federal Government has awarded BluGlass Ltd of Silverwater, Australia $2,999,255 in funding for its project ‘Versatile prototype deposition machine for higher efficiency, energy saving, lower cost LEDs on various substrates including silicon’.

Spun off from the III-nitride department of Macquarie University of Sydney, Australia in 2005, BluGlass developed a low-temperature process using remote-plasma chemical vapor deposition (RPCVD) to grow materials including gallium nitride (GaN) and indium gallium nitride (InGaN) on glass substrates, potentially offering cost, throughput and efficiency advantages for the production of LEDs.

The support for the firm’s continued development of its RPCVD technology represents “an enormous commitment from the Commonwealth Government and demonstrates their continued belief in our ability to bring our breakthrough technology to market,” says CEO Giles Bourne. Read More

TSMC Forecasts Tepid Q3

Foundry chipmaker Taiwan Semiconductor Manufacturing Co. Ltd. has said that demand for its wafers will “moderate” in the third quarter after it reported record sales and profits for 2Q13. Third-quarter sales are set to be up between 3.3 and 5.2 percent from Q2, TSMC announced along with its financial result for 2Q13.

TSMC made a record-breaking net income of NT$51.81 billion (about US$1.73 billion) on record consolidated revenue of NT$155.89 billion (about $5.2 billion) in the second quarter of 2013.

Year-over-year the quarterly revenue was up 21.6 percent while it was up 17.4 percent compared with 1Q13. This is an exceptionally large increase for Q2 sequential growth at TSMC but was expected, being just above the mid-point of previous forecast. In US dollar terms the Q2 revenue increased 15.9 percent from the previous quarter and increased 20.7 percent year-over-year. Read More

ClassOne Equipment to Unveil Polaris™ Controller at SEMICON West

PLC Controller Breathes New Life into Semitool® 302 Based Platforms

ClassOne Equipment announced today that it will be demonstrating its all-new PLC controller upgrade for its remanufactured Semitool® product line at SEMICON West.  The new PolarisTM control system has been developed as a field-upgradeable replacement for the antiquated Semitool 302 control system.  Polaris features intuitive state of the art electronics with fully configurable software for real time control, data-logging, and communications, driven by an intuitive graphical user interface, designed and developed by former Semitool veterans at ClassOne Technology, a wholly owned subsidiary of ClassOne Equipment.

The new Polaris PLC upgrade offers the following benefits and advantages:

– Significantly extends the life of existing 302-based systems (SAT, SST, Equinox® and LT-210C), significantly reducing fab CAPEX.

– Brand new Quad-Core CPU with Windows®, replaces the old, obsolete 486-based processor and proprietary software.

– Flexible reconfiguration of the system, such as adding tanks and changing pumps.

– Dual hard drives and RAID configuration for hot-swapping and backup for increased uptime.

– Ethernet network connectivity allows remote data logging, real time chemical consumption monitoring, predictive maintenance functions, email notifications and reporting.

– Reversible cassette rotation for enhanced process capability

– Integration of off the shelf electronics with fully configurable software.

“Semitool’s Spray Solvent and Spray Acid tools have been the work-horses of the industry for decades with hundreds of units installed around the world.  Because of this, refurbished tools continue to be highly sought after,” said Byron Exarcos, President of ClassOne Equipment.  “The Polaris control system brings all the advantages of a modern control system to a time-tested platform while maintaining and enhancing the key elements of performance and cost-effectiveness.  Not only does this upgrade offer additional and useful features to the user, it eliminates the concerns over the age of a core component in tools based upon the aging Semitool 302 controllers.  This competitively priced, critical update will breathe new life into an industry standard platform and extend its useful life for years.”

The Polaris controller will be highlighted in ClassOne’s booth (#441) at SEMICON West in San Francisco from July 9th through 11th where it will be installed in a Semitool Spray Solvent Tool.  The Polaris will be offered as a stand-alone field upgrade and as an optional upgrade for tools remanufactured by ClassOne Equipment.

About ClassOne Equipment

ClassOne Equipment (http://ClassOneEquipment.com) is a recognized leader in the business of equipment refurbishment with over 2,500 tools installed world-wide in four key markets:  Semitool Wet Chemical Processing, SPTS Plasma Etching & PECVD, Suss/EVG Mask Aligners, and KLA-Tencor Wafer Inspection.   Known for superior quality 75 to 300mm equipment, customer-first service, and its 30-day unconditional return policy, the ClassOne team has been winning and serving customers in the traditional semiconductor and emerging technology sectors for over 10 years.

For more Information Contact:

Byron Exarcos

ClassOne Equipment

770.808.8708

HORIBA Announces New HD-960L Dissolved O2 Monitor

 HORIBA is proud to introduce the HD-960L Dissolved O2 monitor for HF and other acids (e.g. Citric Acid). Leading edge device manufacturers are increasingly using low O2 chemicals to prevent galvanic corrosion on Cu and other metals in both BEOL and FEOL applications. The HD-960L utilizes Membrane Polarography technology to provide an effective method to monitor the O2 level present with sub ppb level resolution. 

Secondary Equipment Market Stays Strong

By Jeff Dorsch

There’s a lot of used semiconductor production equipment in the world, and when its original owners no longer need or want it, there are companies glad to take it off their hands.

There will 18 exhibitors in the secondary equipment field at SEMICON West this year. That’s “slightly more [exhibitors] than last year,” says Tom Salmon, SEMI’s vice president of global member services and standards, who heads up the organization’s Secondary Equipment & Services (SEA) special interest group. There will once again be a Secondary Equipment and Services TechZONE pavilion on the exhibit floor this year, in the South Hall of Moscone Center.

The SEA group has chapters in “nearly every SEMI region,” Salmon notes. The Americas chapter organized the “Productivity Innovation: Reducing Cost and Improving Performance at 200mm/300mm Wafer Fabs” session held Wednesday afternoon at the TechXPOT South booth, across the aisle from the SEA pavilion. Not all secondary equipment exhibitors will be in the SEA pavilion, but most will be.

The program summary for the TechXPOT session notes, “Many of today’s most productive 200mm and 300mm fabs are successful because they excel at rapid changeover and process flexibility, leverage the secondary equipment market for reduced cost and fast ramp-up, and deploy the latest advances and ideas in tool and materials productivity.  This session will provide practical solutions and ideas to improve productivity at existing lines and fabs, including materials management, use and recovery, secondary equipment solutions, predictive tool maintenance and uptime strategies, energy efficiency, and other ideas for mature process lines and fabs.”

“North American fabs have been in operation for some time,” Salmon observes. He says the question for them is: “What methods can we use to maintain productivity in these fabs?” And cost is a key consideration in that evaluation, according to Salmon.

Secondary equipment companies specialize in “making legacy equipment more productive,” Salmon says. As a result, “the services part of the business will be significantly larger than the equipment part of the business,” he adds.

SEMI and Semico Research two years ago produced a study estimating that the secondary equipment market was worth $6 billion in 2010. More recent figures aren’t available, but the SEA group is developing a second edition of the study, Salmon reports.

If you’re using Twitter, look for the #SecondarySEMI hashtag in tweets.

There are reports that the used-equipment business has been in a prolonged downturn as the semiconductor industry has struggled to grow for the past two years, resulting in less investment in new production equipment and less wafer fab equipment turnover. Most of the leading integrated device manufacturers and silicon foundries are increasing their capital-expenditure budgets this year, however, which could create opportunity in secondary equipment and related services.

Abdi Hariri, the group vice president of global operations at Lam Research, heads up Lam’s Customer Support Business Group. Identifying trends in the secondary equipment market, he says, “We see a broad application of our tools in the secondary equipment market. There are of course the legacy technologies (>65nm, 150mm, 200mm tools), as well as some of the non-critical 300mm applications, but there are a couple of other market segments, such as MEMS, LED and OSAT, that are using tools that have been previously used for mainstream logic or memory processing.”

Asked about how Lam regards the secondary equipment market, which some vendors see as potentially detrimental to their service and spares business, Hariri says, “Many of our customers have fabs and equipment that are more than 10 years old. Some have both leading-edge and legacy fabs. We have a life cycle strategy in our company to support our customers in various stages of their fab and equipment life cycle. We like to see our equipment running at their most optimum design potential and as such we are very active in this market. We strongly believe that the original equipment manufacturer (OEM) is uniquely suited to provide the required refurbishment knowledge and expertise as well as follow-on service and support that enables a fab buying used equipment to predictably deliver to the tight, production-ready timelines that our customers need.”

Software copyright issues are a perennially touchy subject in used equipment. Most OEMs insist on being paid for the software when equipment is sold to third parties. Lam’s Hariri says on this subject, “Our equipment is sold with a non-assignable, non-transferable software license to the original purchaser of the tool. The operating system is what enables the system to work, and we have an ongoing investment in maintenance, quality control and development of our software. We do require purchasers of our equipment to obtain a software license from us.”

Like other large vendors of wafer fabrication equipment, Lam does a tidy business in providing service and spare parts for its gear. As Hariri says, “There are many more legacy fabs in operation today than leading edge. Our customers expect us to support them during all aspects of their fab and product life cycle and we have various organizations and resources that support the needs of our customers. This is also a significant business that supports our investments during the industry down cycles.”

EU Goal: Reach 20% World Share in Chip Manufacturing by 2020

EU to spend € 10 billion to trigger € 100 billion investments — SEMI provides the platforms for our members to share critical implementation issues and actions to support the goals set by the EU   

Heinz Kundert hands a 450mm Wafer to European Commission vice president Neelie KroesEuropean Commission vice president Neelie Kroes is determined to radically improve Europe’s semiconductor manufacturing landscape: 10 billion Euros is on the table and industry has promised to invest another 100 billion Euros. “Like the Airbus experience, it is possible to achieve even the unthinkable. Europe has the strengths and critical industries to regain a market share of 20 percent in chip manufacturing by 2020. This will create around 250,000 new jobs. However, it will be of paramount importance to work and invest together, cross-border and along the entire food-chain,” said Commissioner Kroes.

The new European industrial strategy for micro and non-electronics will include an Industrial Strategy Roadmap for Investment, which will be developed by the end of 2013. It will cover: Transition to 450mm; “More than Moore” on 200mm and 300 mm; and “More Moore” for ultimate miniaturization on 300mm wafers

This strategy is the culmination of years of industry advocacy for a clear European commitment to manufacturing. SEMI first called for measures to support investment in manufacturing in its 2008 White Paper. We have since contributed to the work of two High Level Groups on Key Enabling Technologies and will join the KETs Implementation Observatory to be launched by the end of this year.

Implementing the new strategy starts now and SEMI will assist, looking at latest technology developments and helping SEMI members create partnerships, link up with RTOs and benefit from the European investment strategy.  Don’t miss the “10/100/20: Update on Europe’s New Semiconductor Strategy” at Moscone Center, South Hall (Wednesday, July 10 at 4:00-4:30pm).

 

The New Player in the Foundry Business

By Jeff Dorsch

In the silicon foundry business, there’s a new kid on the block – and it’s a chipmaker who’s been around the block more than a few times.

Intel’s Custom Foundry group was established three years ago, yet it’s been attracting a lot of attention in the past year. Altera and Microsemi have signed on as customers, and Cisco Systems is reportedly a customer for the Intel business. With the continuing fallout between Apple and Samsung Electronics, who provides foundry services for the custom-designed processors in Apple’s mobile devices, there has been speculation that Intel’s foundry may pick up part of Apple’s foundry orders.

The chipmaker’s other publicly announced foundry customers are Achronix Semiconductor (field-programmable gate arrays), Netronome (network processors), and Tabula (also FPGAs). These fabless semiconductor companies, along with Microsemi, which does have its own wafer fabrication facilities, are interested in Intel’s manufacturing prowess – in particular, its 22-nanometer, 3D Tri-Gate process. There are other presumed customers whose identities have yet to be announced or who have been mentioned only in industry rumors.

Brian Krzanich, IntelIntel’s new chief executive officer, Brian Krzanich, comes from the manufacturing side of the company, leading to speculation that he will look to boost the chipmaker’s foundry’s business.

Intel is advertising positions within the Custom Foundry group in Chandler, Ariz., and Hillsboro, Ore., where it has wafer fabs, and in Bangalore, home of the Intel India Development Center and the Intel India Systems Research Center. It is seeking to hire an analog layout manager, a foundry customer engineer, a physical verification engineer, and a senior software engineer, among other jobs.

“Intel is looking at all the problems in the PC business,” says Risto Puhakka, president of market research firm VLSIresearch. “There are various alternatives to growing their business. Foundry is one of them.”

While Intel has attracted some A-list semiconductor companies and startups, “they’re quite a ways away” from being “a full-fledged foundry,” he adds. “I wouldn’t rank them with TSMC [Taiwan Semiconductor Manufacturing Company], GlobalFoundries, or Samsung.”

Still, “they definitely have interest in working with selected companies,” Puhakka says of Intel Custom Foundry.

Semiconductor suppliers are interested in having Intel fabricate their chips because of the company’s advanced manufacturing technology, he notes. “Intel is two years ahead,” Puhakka says. Already turning out chips with 22-nanometer features, when other foundries are coming up to speed on 28-nanometer devices, Intel is looking ahead to 14-nanometer chips with FinFETs, he observes. Those semiconductor companies that can make use of that advanced process will have a competitive advantage in the marketplace, Puhakka says, creating “winners and losers” – that is, Intel foundry customers and those unable to avail themselves of Intel’s foundry services.

In 2013, the silicon foundry business in general is “really the bright spot in the industry,” Puhakka says. GlobalFoundries is “doing quite well,” he adds, and Taiwan Semiconductor Manufacturing isn’t letting any of its worldwide competitors catch up with them.

“The majority of [semiconductor] equipment sold these days is the foundry business, followed by memory,” Puhakka says.

In 2012, the global market for foundry services was worth $34.6 billion, up 16.2 percent from 2011, according to Gartner, with TSMC accounting for just under half of those revenues. GlobalFoundries overtook United Microelectronics Corp. as the second largest foundry in the world, measured by revenues, with $4.2 billion in revenues to UMC’s $3.6 billion, Gartner estimates.

“2012 was the first year that the semiconductor revenue for mobile devices surpassed that of PCs and notebooks,” said Samuel Wang, Gartner’s research vice president, in a statement. He added, “It also marked the first year that advanced technology for mobile applications drove the foundry revenue. Furthermore, 2012 saw not only major foundries improve the yield of 28-nanometer technology, but also many foundries fine-tuned the device performance of legacy nodes.”

Coming in fourth and fifth last year among foundries were Semiconductor Manufacturing International Corp. and Samsung Electronics, at $1.7 billion and nearly $1.3 billion, respectively, according to Gartner. The market research firm filled out the top dozen list with Tower Semiconductor/Jazz Semiconductor (which does business as TowerJazz), IBM Microelectronics, Shanghai Hua Hong NEC Electronics (which last year included Grace Semiconductor Manufacturing, acquired in 2011), Vanguard International Semiconductor, Dongbu HiTek, and MagnaChip Semiconductor, in that order.

Demand for low-cost smartphones in China and other emerging countries drove demand for foundry wafers with 40-nanometer semiconductors during the second half of 2012, Gartner notes. Foundries also shipped near-record numbers of complementary metal-oxide semiconductor image sensors, embedded flash memory chips, high-voltage devices, microelectromechanical system devices and power management integrated circuits in 2012, according to the market research firm.

Among the top three silicon foundries, only UMC is scaling back its budget for capital expenditures in 2013, from $1.7 billion last year to $1.5 billion this year, according to Semiconductor Intelligence. The market research firm sees TSMC increasing its capex budget by 17 percent this year to $9.8 billion, from last year’s $8.2 billion, while GlobalFoundries is boosting its capital expenditures by 16 percent to $4.4 billion, compared with $3.8 billion in 2012.

Samsung Electronics is apparently standing pat this year with $12.9 billion in capital expenditures, and Intel is increasing its capex by 9 percent in 2013, to $12 billion from last year’s $11 billion, according to Semiconductor Intelligence.

Whether or not Intel expands its Custom Foundry group business this year remains a question. What is clear is that Intel is certain to lead the industry in turning out the most advanced and complex chips in the world for themselves and now for certain select customers.

Changing Trends in Semiconductor Test

By Jeff Dorsch

The semiconductor test equipment market has changed dramatically in this century. Mobile devices have brought changes to the market, and their driving force is likely to impact the business for years to come. “Everyone on Earth has a smartphone or wants to buy one,” says Greg Smith, general manager of the Complex SoC unit at Teradyne. Different types of devices are being tested, and the number of leading automatic test equipment vendors has dwindled to three.

There are more customers requiring IC testers to have the “ability to log gigabits of data,” Smith says. “Customers are investing heavily in design-for-test technology.” Electronic design automation software tools are helping to “improve yield through design and test,” he notes. “We’re being asked to support design more than before.”

Steve Wigley, vice president of marketing at LTX-Credence, says data was always available to chipmakers and their ATE vendors, but “it wasn’t pulled together.” Now, “people are definitely focused on getting more data,” he says, while adding, “I’m not sure I would classify this as ‘big data.’ ”

Tom Morrow, SEMI’s chief marketing officer, sees “big data” technology having an impact on semiconductor test. “Basic statistical analysis is being done on all data,” he says. “It’s beyond pass/fail.” Chipmakers and their ATE vendors are “using more and more available data. It gets fed back into the test system for faster test times,” Morrow adds. Big-data analytics, he notes, helps answer the question, “How do I use this big iron?”

While the data sets may be bigger, the number of major players in semiconductor ATE has narrowed in recent years to Advantest and Teradyne. LTX-Credence trails as a much smaller third player, and many suppliers of specialty test equipment follow this triad. The ATE market is “mature, consolidated,” Morrow says, with Advantest acquiring Verigy in 2011, LTX and Credence Systems merging in 2008, and Teradyne buying Eagle Test Systems in 2008.

Teradyne’s Smith says the chip-testing market competition is chiefly between Teradyne and Advantest, with those two vendors commanding 85 percent of the market. “LTX-Credence is the largest of the rest,” he comments. Yokogawa Electric also stands out in the ATE pack, Smith says.

“We definitely see strong competition in linear and power management test from LTX,” Smith says. “Not to be disrespectful, but they are not as strong in complex SoC (test).”

Wigley acknowledges that Advantest and Teradyne are the big dogs in ATE, at least as measured in sales volume. “There are the big two, then ourselves, then regional players,” he says. LTX-Credence’s competitive advantage is that “we don’t try to be all things to all people,” Wigley adds.

Device Trends

The year 2013 has marked “the resurgence of microcontroller test,” Smith observes. Teradyne has “very strong share in microcontrollers, image sensors, and linear ICs,” he says. Smith adds, “Our major competitor,” (meaning Advantest) mostly plays in the “CMOS space,” handling a wide variety of devices.

“Very complex devices are being produced in greater volume than ever before,” Smith says.

The leading trend in semiconductor ATE, Wigley says, is “the ubiquity of RF” – radio-frequency devices. With microcontrollers, he adds, “we see RF requirements coming out of companies in that space.” The “Internet of Things,” where more and more electronic products are connecting to the Internet, is becoming a driver in this trend, Wigley notes. “These are consumer-oriented devices, RF-enabled, and designed to gather data,” he says.

The semiconductor industry was once “focused on tech specifications” in ATE, according to Wigley. Now, “the challenges are much more cost-focused.” Chipmakers want to “make the test cell more productive,” he says. “Life cycles of the (chip) product seem shorter now.”

Equipment Market Trends

Equipment for final testing of devices is moving beyond testing microprocessors and other widely used parts, SEMI’s Morrow notes. Light-emitting diodes and microelectromechanical system devices are emerging as critical parts that need testing, he says. Meanwhile, metrology is imposing “new test requirements,” he adds. “Metrology systems haven’t been part of semiconductor testing in the past.”

Not including memory testers, Wigley estimates the semiconductor test equipment market will be worth $2 billion to $2.1 billion this year. He sees the market shaping up as “roughly the same as last year, maybe 5 percent to 10 percent better.”

Smith says, “This year is shaping up about the same as last year,” although with “a very different profile.” He notes, “2012 started strong and weakened as the year went on. It continued into the first quarter (of 2013).” Smith adds that semiconductor test equipment sales last year were “very, very strongly driven by the mobile area.”

For the long-term perspective, the Teradyne executive sees mobile devices continuing to dominate electronics and semiconductors in the near future. “Smartphones and tablets will continue (to drive ATE sales) for the next two to three years,” Smith says.

LTX-Credence’s Wigley says, “Our experience is from a market point of view. There’s going to be ups and downs.” He predicts “relatively flat revenues” for the ATE market and “huge efforts to improve the backend of the (fab) line.”

SEMI’s Morrow anticipates a flurry of ATE-related activity at this year’s SEMICON West. Advantest will have “a lot of new product announcements,” he says. There’s also the TestVision 2020 workshop which concludes Thursday at the Marriott Marquis Hotel, and a TechXPOT session devoted to semiconductor test to be held Tuesday afternoon in Moscone Center’s North Hall.

All in all, the only thing you can count on being constant in the semiconductor test business is change. Those who adapt to changes in business and technology will prosper and thrive.

 

HORIBA Company Profile

The HORIBA Group of worldwide companies provides an extensive array of instruments and systems for applications ranging from automotive R&D, process and environmental monitoring, in-vitro medical diagnostics, semiconductor manufacturing and metrology, to a broad range of scientific R&D and QC measurements. Proven quality and trustworthy performance have established widespread confidence in the HORIBA Brand.

Supporting the evolution of smart life styles with high-precision technologies, HORIBA Semiconductor  offers a comprehensive range of control and analytical solutions to improve yield, increase throughput, and add value to the Semiconductor, Flat Panel Display (FDP), Light Emitting Diode (LED),  Photovoltaic (PV) and related manufacturing and research industries.

From advanced high-accuracy Fluid Delivery technology to such diverse applications as wet process, dry process, lithography metrology and process monitoring, HORIBA is the global leader in bringing scientific expertise and industry know-how together to produce critical technologies required for tool matching, recipe creation, and the final goal of maintaining a stable process by using advanced process control.

HORIBA’s special blend of global companies, technologies, and culture are bringing creative solutions to the problems of designing the next generation processes that have been essential to the advancements made in semiconductor technology.

Inspired by our unique motto, “JOY and FUN,” we focus on social responsibilities by building state-of-the-art products for scientific advancement; especially for protecting health, safety, and the environment. “HORIBARIANs,” the HORIBA employees all over the world, are looking forward to working with you and providing the best analytical and process control solution for your needs. Please visit us at SEMICON West 2013, booth 1819.